Method for fabricating array substrate for X-ray detector
View Patent ↗An array substrate for use in an X-ray sensing device is fabricated using an etching stopper that enables good control of the etching process and that prevents over-etch of drain electrodes and second capacitor electrodes while forming contact holes and a cutting furrow. The etching stopper is located in a tiling portion that is utilized for tiling substrates to form a large-sized X-ray detector. During fabrication, gate lines can have gate-protruded portions located near the etching stopper, and the etching stopper can have stopper-protruded portions near the gate lines. The stopper-protruded portions electrically connect to the gate-protruded portions through gate line contact holes such that the etching stopper and the gate lines have equipotentials. This can reduce static electricity damage.
1. An array substrate comprising:
a plurality of gate lines on a substrate, each gate line having at least one gate electrode and a gate-protruded portion;
a first insulation layer over the gate lines, over the gate electrodes, over the gate protruded portions, and over the substrate;
a plurality of gate line contact holes, each passing through said first insulation to said gate-protruded portions;
a conductive shorting element having a plurality of stopper-protruded portions that electrically connect to the gate lines via the gate-protruded portions, wherein said conductive shorting element electrically connects said plurality of gate lines together, and wherein said conductive shorting element is comprised of a conductive material;
a plurality of thin film transistors on said first insulation layer, each thin film transistor located over a gate electrode and having a source electrode, a drain electrode, an ohmic contact layer, and a channel region in an active layer;
a plurality of drain electrodes, each contacting an ohmic contact layer of an associated thin film transistor;
a plurality of data lines on said first insulation layer, each data line having a plurality of source electrodes that electrically contact to a plurality of ohmic contact layers, wherein said plurality of data lines cross said plurality of gate lines to define a plurality of pixel regions;
a ground line under each pixel region, said ground line being on said first insulation layer;
a first capacitor electrode over said ground line and over a portion of said first insulation layer, said first capacitor electrode electrically connecting to said ground line, wherein said first capacitor electrode is comprised of said conductive material;
a protection layer over said thin film transistor, over said data lines, over said source electrodes, over said drain electrodes, over said conductive shorting element, and over said first capacitor electrode;
a plurality of second capacitor electrodes on said protection layer and over said first capacitor electrodes;
a second insulating layer over said protection layer and over said second capacitor electrodes; and
a cutting furrow through said second insulating layer and through said protection layer to said conductive shorting element.
2. An array substrate according to claim 1 , further including a capacitor electrode contact hole through said second insulation layer to said second capacitor electrode.
3. An array substrate according to claim 2 , further including a drain contact hole through said second insulation layer and through said protection layer to a first drain electrode of said plurality of drain electrodes.
4. An array substrate according to claim 3 , further including a pixel electrode, wherein said pixel electrode electrically contacts said first drain electrode through said drain contact hole in said protection layer.
5. A photo detector having a plurality of pixels, comprising:
a thin film transistor (TFT) on an array substrate having a gate electrode, a source electrode, a drain electrode, a first insulation layer, an active layer and a pixel electrode, the first insulation layer being between the gate electrode and the active layer, the pixel electrode electrically connected to the drain electrode of the TFT;
a storage capacitor having a ground line, a first capacitor electrode on the ground line, a second capacitor electrode and a protective layer between the first and second capacitor electrodes, the pixel electrode electrically connected to the second capacitor electrode;
a photo-conductive layer on the pixel electrode for converting light into electron-hole pairs;
a conductive electrode on the photo-conductive layer for applying an electric field to the photo-conductive layer along with the pixel electrode; and
a tiling portion for tiling the array substrate, the tiling portion having an etching stopper between the first insulation layer and the protection layer, the etching stopper including a transparent conductive material.
6. A photo detector according to claim 5 , wherein the first insulation layer is made of a material selected from a group consisting of Silicon Nitride (SiNx), Silicon Oxide (SiOx), BCB (Benzocyclobutene) and an acryl.
7. A photo detector according to claim 5 , wherein the first capacitor electrode, the second capacitor electrode and the pixel electrode are made of a transparent conductive material.
8. A photo detector according to claim 7 , wherein the transparent conductive material is Indium-Tin-Oxide (ITO) or Indium-Zinc-Oxide (IZO).
9. A photo detector according to claim 5 , wherein the protection layer is made of Silicon Nitride (SiNx).
10. A photo detector according to claim 5 , further including a second insulation layer between the pixel electrode and the second capacitor electrode.
11. A photo detector according to claim 10 , wherein the second insulation layer is made of BCB (Benzocyclobutene).
12. A photo detector according to claim 5 , wherein the etching stopper is formed at the same time as the first capacitor electrode.
13. A photo detector according to claim 5 , wherein the etching stopper is electrically connected to a gate line of the array substrate.