Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof
View Patent ↗Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, moreover, can sustain the adhesive strength at a high ratio after exposure to high temperature or high temperature and high humidity. Owing to these characteristics, these polyimide/metal laminates are appropriately usable in flexible print wiring boards, multi-layered print wiring boards, rigid flex wiring boards, tapes for TAP, semiconductor packages such as CFOs and multi chip modules (MCMs), magnetic recording films, coating films for aerospace materials and filmy resistance elements.
1. A flexible printed wiring board obtained by patterning by etching the metal layer of a polyimide/metal laminate, said polyimide/metal laminate having a polyimide film and a metal layer laminated thereon, wherein said polyimide film contains titanium element,
wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
2. The flexible printed wiring board as claimed in claim 1 , wherein the polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film.
3. A flexible printed wiring board obtained by patterning by etching the metal layer of a polyimide/metal laminate, said polyimide/metal laminate having a polyimide film and a metal layer laminated thereon, wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film,
wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
4. The flexible printed wiring board as claimed in claim 2 or 3 , wherein the polyimide film is obtained by applying an organic solvent solution containing titanium element onto the surface of said partly cured or partly dried polyamic acid or polyimide film, or immersing said film in an organic solvent solution containing titanium element; removing excess droplets remaining on the film surface; then converting said polyamic acid into the polyimide; and drying said film.
5. The flexible printed wiring board as claimed in claim 2 or 3 , wherein said organic solvent solution containing titanium element is a solution of an organotitanium compound in an organic solvent.
6. The flexible printed wiring board as claimed in claim 5 , wherein said organotitanium compound is one represented by the following chemical formula:
(R 1 O) m —Ti—(OX) 4−m
wherein m is an integer of 0 to 4; and x represents
(Wherein R 1 represents a hydrogen atom or a C 3-18 hydrocarbyl group; R 2 and R 3 represent each and C 3-18 hydrocarbyl group; R 4 represents a C 3-18 hydrocarbyl group or
R 5 and R 6 represent each a C 3-18 hydrocarbyl group; and R 7 represents a C 2-18 hydrocarbyl group), a C 3-18 hydrocarbyl or carboxylate group or ammonium salts thereof.
7. The flexible printed wiring board as claimed in claim 1 or 3 which is obtained by laminating said metal directly on said polyimide film by vacuum metallizing method, sputtering method or wet plating method, wherein an adhesive strength between said polyimide and said metal measured at pattern intervals of 3 mm and at a peel angle of 90° and a peel speed of 50 mm/min is 1000 N/m or more.
8. The flexible printed wiring board as claimed in claim 1 or 3 , wherein said polyimide film is obtained by dehydrocyclizing a polyamic acid comprising as main components pyromellitic anhydride and 4,4′-diaminodiphenyl ether.
9. The flexible printed wiring board as claimed in claim 1 or 3 , wherein said polyimide film is obtained by dehydrocyclizing a polyamic acid comprising as main components three components of pyromellitic anhydride, 4,4′-diaminodiphenyl ether and p-phenylenediamine.
10. The flexible printed wiring board as claimed in claim 1 or 3 , wherein said polyimide film is obtained by dehydrocyclizing a polyamic acid comprising as main components four components of pyromellitic anhydride, 4,4′-diaminodiphenyl ether, p-phenylenediamine and p-phenylenebis(trimellitic acid monoester acid anhydride).
11. A multi-layered printed wiring board, wherein plural flexible printed wiring boards as claimed in claim 1 or 3 are laminated.
12. A rigid flex wiring board, wherein the flexible printed wiring board as claimed in claim 1 or 3 is laminated on a hard printed wiring board.
13. A tape for tape automated bonding (TAB) appropriate for semiconductor packaging, wherein a polyimide/metal laminate has a polyimide film and a metal layer, wherein said polyimide film contains titanium element, wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
14. The tape for tape automated bonding (TAB) as claimed in claim 13 , wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film.
15. A tape for tape automated bonding (TAB) appropriate for semiconductor packaging, wherein a polyimide/metal laminate has a polyimide film and a metal layer, wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film,
wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
16. A chip on film (COF) having a semiconductor device directly packaged on a printed wiring board, wherein a polyimide/metal laminate has a polyimide film and a metal layer, wherein said polyimide film contains titanium element, wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
17. The chip on film (COF) as claimed in claim 16 , wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film.
18. A chip on film (COF) having a semiconductor device directly packaged on a printed wiring board, wherein a polyimide/metal laminate has a polyimide film and a metal layer, wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film,
wherein the titanium element concentration at a center of said polyimide film thickness direction is 1/10 or less of the titanium element concentration on a surface of the polyimide film,
wherein said polyimide film has a titanium atom number concentration on the surface of said polyimide film, determined by X-ray photoelectron spectroscopy, of from 0.01% to 10%.
19. A flexible printed wiring board comprising a polyimide film and a metal layer laminated thereon, wherein said polyimide film is obtained by casting or applying a polyamic acid onto a substrate; drying the same to give a partly cured or partly dried film made of the polyamic acid or a polyimide; applying an organic solvent solution containing titanium element on the surface of said film, or immersing said film in an organic solvent solution containing titanium element; then converting said polyamic acid into the polyimide; and drying said film, wherein said polyimide film is obtained by dehydrocyclizing a polyamic acid comprising as main components four components of pyromellitic anhydride, 4,4′-diaminodiphenyl ether, p-phenylenediamine and p-phenylenebis(trimellitic acid monoester acid anhydride).