Diffusion bonded composite material and method therefor
View Patent ↗Methods and apparatus are provided for forming a diffusion bonded composite structure. The composite structure includes at least one internal void or feature. Surfaces to be bonded are cleaned and prepared for bonding. The exposed joints of the composite structure where the surfaces interface are sealed. The composite structure is placed in hot isostatic process furnace. The furnace is pressurized to a low pressure below 1500 pounds per square inch that forces the surfaces to be bonded in intimate contact with one another. The composite structure is heated to promote diffusion bonding at the interface of surfaces in contact with one another.
1. A process for bonding a composite structure for high temperature applications made of Ni based materials comprising the steps of:
etching surfaces of the composite structure to be bonded together to remove oxide;
electrodepositing a layer of nickel on said etched surfaces of the composite structure to be bonded together before oxidation of said etched surfaces occurs to prevent an oxide layer from forming on at least one of said etched surfaces;
sealing exposed joints of the composite structure; and
applying hot isostatic processing to the composite structure at low pressure wherein a pressure of between 25 and 1500 pounds per square inch is used during a heat cycle.
2. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 wherein the step of etching surfaces of the composite structure to be bonded together to remove oxide further includes a step of performing an anodic phosphoric acid etch on said surfaces of the composite structure to be bonded together.
3. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 2 wherein the step of performing an anodic phosphoric acid etch on said surfaces of the composite structure to be bonded together further includes a step of performing cathodic activation using sulfuric acid on said surfaces of the composite structure to be bonded together.
4. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 wherein the step of electrodepositing a layer of nickel on said surfaces of the composite structure to be bonded together further includes a step of plating nickel using a Ni-strike process that includes a solution of Ni-Chloride.
5. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 4 wherein the step of electrodepositing nickel using a Ni-strike process that includes a solution of Ni-Chloride further includes a step of electrodepositing using a Ni-plate process that includes a solution of Ni-sulfamate.
6. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 wherein the step of sealing exposed joints of the composite structure further includes the steps of:
cleaning said surfaces of the composite structure to be bonded together; and
welding said exposed joints of the composite structure.
7. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 wherein the step of applying hot isostatic processing to the composite structure further includes the steps of heating the composite structure within a temperature range of 1500 to 2225 degrees Fahrenheit.
8. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 wherein the step of applying hot isostatic processing to the composite structure further includes a step of forming diffusion bonds at an interface of said surfaces of the composite structure to be bonded together wherein said layer of nickel formed on said surfaces diffuses into the composite structure.
9. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 , wherein applying the hot isostatic processing includes heating the composite structure at a temperature that is less than a melting temperature of the layer of nickel to maintain the layer of nickel in a solid state.
10. The process for bonding a composite structure for high temperature applications made of Ni based materials of claim 1 , wherein each of the surfaces of the composite structure are non-planar.
11. A diffusion bonding process comprising:
etching non-planar surfaces of a composite structure to be bonded together to remove oxide;
depositing a layer of nickel on at least one of the etched non-planar surfaces to limit formation of an oxide layer;
sealing a perimeter of an interface between the non-planar surfaces of the composite structure;
applying isostatic pressure to the composite structure; and
heating the composite structure in combination with applying the isostatic pressure at a temperature that is less than a melting temperature of the layer of nickel.