IP Library Granted Patent US 6,853,073
Granted Patent B2
US 6,853,073 · App. 10/442,966 · Granted Feb 8, 2005

Microwave electronic devices comprising a metal enclosure

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Quick Facts
Patent No.
US 6,853,073
App. No.
10/442,966
Granted
Feb 8, 2005
Kind
B2
Abstract

The present invention relates to a microwave electronic device ( 1 ) comprising a metal enclosure ( 2 ) having a bottom ( 21 ) and a lid ( 23 ) and containing an electronic circuit board ( 3 ) disposed substantially parallel to said bottom and to said lid, said circuit board having: conductive bottom and top grounding layers ( 41, 42 ) respectively disposed on bottom and top faces ( 31, 32 ) of the circuit board, and perforations ( 7 a ) transverse to said faces of the circuit board and delimited by conductive walls ( 71 ) for electrically interconnecting said layers ( 41, 42 ). At least some of said walls ( 71 ) are electrically connected to the lid of the enclosure by conductive grounding members ( 8 a ). Each conductive member ( 8 a ) has a metal blade covered with a material ( 13, 13 ′) for absorbing microwaves.

Claims (11)

1. A microwave electronic device ( 1 ) comprising a metal enclosure ( 2 ) having a bottom ( 21 ) and a lid ( 23 ) and containing an electronic circuit board ( 3 ) disposed substantially parallel to said bottom and to said lid, said circuit board having:

conductive bottom and top grounding layers ( 41 , 42 ) respectively disposed on bottom and top faces ( 31 , 32 ) of the circuit board, and

perforations ( 7 , 7 a ) transverse to said faces of the circuit board and delimited by conductive walls ( 71 ) for electrically interconnecting said bottom and top grounding layers ( 41 , 42 ), at least some of said walls ( 71 ) being electrically connected to the lid of the enclosure by conductive grounding members ( 8 , 8 a , 8 b ), which device is characterized in that each conductive member ( 8 a ) has a metal blade ( 11 , 11 ′) disposed between said lid and said top layer in a blade plane (P 1 ) perpendicular to said faces ( 31 , 32 ) and covered at least in part with a material ( 13 , 13 ′) for absorbing microwaves at frequencies less than or equal to a maximum operating frequency of said device.

2. A microwave electronic device ( 1 ) according to claim 1 , characterized in that each conductive member ( 8 a ) has two metal blades ( 11 , 11 ′) disposed in the same blade plane (P 1 ).

3. A microwave electronic device ( 1 ) according to claim 2 , characterized in that the respective blade planes (P 1 , P 2 ) of two adjacent needles ( 8 a , 8 b ) are substantially perpendicular.

4. A microwave electronic device ( 1 ) according to claim 1 , characterized in that said grounding members ( 8 , 8 a , 8 b ) are disposed so that the distance between the centers of two adjacent members ( 8 a , 8 b ) is less than the associated half-wavelength at said maximum frequency.

5. A microwave electronic device ( 1 ) according to claim 1 , characterized in that the top grounding layer ( 42 ) is formed of a plurality of substantially square metal members ( 5 , 5 a ) each having one of said perforations ( 7 a , 7 a ) at its center and receiving an associated grounding member ( 8 , 8 a , 8 b ).

6. A microwave electronic device ( 1 ) according to claim 1 , characterized in that each grounding member ( 8 , 8 a , 8 b ) has a portion in the form of a metal needle ( 8 a ) perpendicular to said faces ( 31 , 32 ) and having a cylindrical top part ( 82 ) and a frustoconical bottom part ( 83 ) extended by said associated perforation ( 7 a ) and in contact with said top grounding layer ( 42 ).

7. A microwave electronic device ( 1 ) according to claim 6 , characterized in that each of said needles ( 8 , 8 a , 8 b ) is centered on a respective square member ( 5 , 5 a ) and said top part ( 82 ) has a diameter between the diameter of the associated perforation ( 7 a ) and the side length of the associated square ( 5 a ).

8. A microwave electronic device ( 1 ) according to, claim 1 characterized in that the lid ( 23 ) has cavities ( 10 ) in its bottom face ( 230 ) each of which is coupled to a grounding member ( 8 a ) via a metal spring ( 9 ) disposed transversely to said bottom face of the lid.

9. An opto-electronic module incorporating a microwave electronic device according to claim 1 .

Assignments (8)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO, INC.
To: LUMENTUM OPTICS INC.
Reel/Frame 049783/0733 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 5, 2014
From: AVANEX CORPORATION
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032826/0276 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0254 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2007
From: HBK INVESTMENTS, L.P.
To: AVANEX CORPORATION
Reel/Frame 019035/0342 →
SECURITY AGREEMENT Recorded May 27, 2005
From: AVANEX CORPORATION
To: HBK INVESTMENTS L.P.
Reel/Frame 016079/0174 →