IP Library › Granted Patent US 6,860,391
Granted Patent B2
US 6,860,391 · App. 10/442,977 · Granted Mar 1, 2005

Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component

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Quick Facts
Patent No.
US 6,860,391
App. No.
10/442,977
Granted
Mar 1, 2005
Kind
B2
Abstract

An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.

Claims (6)

1. An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus comprising:

a first film having a pocket that stores the electronic component, and wherein the pocket has a protrusion at a bottom, and wherein a top of the protrusion contacts with the second surface of the electronic component; and

a second film covering the pocket, and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.

2. The apparatus according to claim 1 , wherein said first and second films are made of an organic substance.

3. The apparatus according to claim 1 , wherein said bottom of said pocket of said first film has a through hole, and wherein the apparatus further comprises a third film covering the through hole.

4. The apparatus according to claim 1 , wherein the apparatus further comprises a third film covering said second film.