IP Library Granted Patent US 7,185,419
Granted Patent B2
US 7,185,419 · App. 10/448,133 · Granted Mar 6, 2007

Method of manufacturing a mask for evaporation

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Quick Facts
Patent No.
US 7,185,419
App. No.
10/448,133
Granted
Mar 6, 2007
Kind
B2
Abstract

A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predetermined pattern and a surface roughness of the mask.

Claims (47)

1. A method of manufacturing a mask for evaporation, the method comprising:

providing a plate having a pattern corresponding to openings to be formed in the mask;

forming a lower coating layer to a predetermined thickness on a portion of the plate not corresponding to the openings to be formed in the mask;

forming a metal layer to a predetermined thickness on the lower coating layer, wherein the lower coating layer has a lower ductility than the metal layer; and

lifting the mask comprising the formed layers from the plate.

2. The method of claim 1 , wherein the metal layer has a thickness of 28–48 μm, and the lower coating layer has a thickness of 2–17 μm.

3. The method of claim 1 , wherein the metal layer is nickel, and the lower coating layer is an alloy of nickel and cobalt.

4. The method of claim 3 , wherein the alloy is formed of 85 weight % of the nickel and 15 weight % of the cobalt.

5. The method of claim 4 , further comprising forming an upper coating layer on the metal layer.

6. The method of claim 5 , wherein the upper coating layer has the same thickness as the lower coating layer.

7. The method of claim 1 , wherein the metal layer comprises iron, chromium and nickel, and the lower coating layer is an alloy of iron, chromium, nickel, and cobalt.

8. The method of claim 1 , wherein the lower coating layer is formed by an electro forming method.

9. The method of claim 1 , wherein the metal layer comprising iron, chromium and nickel, and the lower coating layer is an alloy comprising iron, chromium, nickel, and cobalt.

10. The method of claim 1 , wherein the forming of the metal layer includes forming strips in the metal layer to have a curved shape.

11. A method of manufacturing a mask for evaporation, the method comprising:

providing a plate having a film covering portions of the plate corresponding to openings to be formed in the mask;

forming a lower coating layer to a predetermined thickness on portions of the plate not covered by the film;

forming a metal layer to a predetermined thickness on the lower coating layer, wherein the lower coating layer has a lower ductility than the metal layer; and

lifting the formed layers from the plate.

12. The method of claim 11 , wherein the metal layer has a thickness of 28–48 μm, and the lower coating layer has a thickness of 2–17 μm.

13. The method of claim 11 , wherein the metal layer is nickel, and the lower coating layer is an alloy of nickel and cobalt.

14. The method of claim 13 , wherein the alloy is formed of 85 weight % of the nickel and 15 weight % of the cobalt.

15. The method of claim 14 , further comprising forming an upper coating layer on the metal layer.

16. The method of claim 15 , wherein the upper coating layer has a same thickness as the lower coating layer.

17. The method of claim 15 , wherein the lower coating layer is formed by an electro forming method.

18. The method of claim 11 , wherein the forming of the metal layer includes forming strips in the metal layer to have a curved shape.

19. A method of manufacturing a mask for evaporation, the method comprising:

providing a plate having a pattern corresponding to openings to be formed in the mask;

forming a first layer to a predetermined thickness on a portion of the plate not corresponding to the openings to be formed in the mask;

forming a second layer to a predetermined thickness on the first layer; and

lifting the mask comprising the formed layers from the plate, wherein:

the second layer is formed of a first metal, and

the first layer is formed of an alloy comprising the first metal and a second metal, the alloy having a ductility less than a ductility of the first metal.

20. The method of claim 19 , wherein the first metal is nickel and the second metal is cobalt.

21. The method of claim 20 , further comprising:

forming a third layer on the second layer, the third layer formed of a same alloy as the first layer.

22. The method of claim 19 , wherein the alloy is formed of 85 weight % of nickel and 15 weight % of cobalt.

23. The method of claim 22 , further comprising:

forming a third layer on the second layer, the third layer formed of a same alloy as the first layer.

24. The method of claim 19 , further comprising:

forming a third layer on the second layer, the third layer formed of a same alloy as the first layer.

25. The method of claim 24 , wherein:

the first metal is another alloy comprising iron, chromium and nickel, and

the second metal is cobalt.

26. The method of claim 19 , wherein:

the first metal is another alloy comprising iron, chromium and nickel, and the second metal is cobalt.

27. The method of claim 19 , wherein the forming of the second layer includes forming strips in the second layer to have a curved shape.

Assignments (1)
MERGER Recorded Aug 20, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028816/0306 →