Method of manufacturing a microscale nozzle

1. A method of manufacturing a microscale nozzle comprising the steps of:

forming a microscale channel in a top surface of a substrate, said microscale channel comprising an inlet end and a nozzle-end;

depositing a nozzle-forming layer in a section of the microscale channel; and

removing an material from the substrate at the nozzle-end of the microscale channel to expose at least a portion of said nozzle forming nozzle-forming layer so that said at least a portion of said nozzle-forming layer protrudes from a remaining surface of the substrate.

2. The method according to claim 1 , wherein the nozzle-forming layer comprises a conducting material.

3. The method according to claim 1 , further comprising the step of:

forming a notch in the bottom surface of the substrate, said notch being arranged such that, from a topview, intersects the microscale channel at a selected distance from the nozzle-end towards the inlet, end, wherein

the step of removing material from the substrate is performed as a controlled rupture, enabled by the notch.

4. The method according to claim 3 , characterized in that the steps of forming the microscale channel and forming the notch are performed in one step by injection molding.

5. The method according to claim 1 , wherein the step of removing material from the substrate is performed by laser cutting.

6. The method according to claim 1 , wherein the step of removing material from the substrate is performed by etching.

7. The method according to claim 1 , wherein the substrate is comprised of a polymer.

8. The method according to claim 1 prior to the step of depositing the nozzle-forming layer, further comprising the step of:

surface modifying a nozzle forming section of the microscale channel.

9. The method of manufacturing the microscale nozzle according to claim 1 , wherein,

the substrate is obtained by injection-molding of a polymer-substrate having said microscale channel in the top surface and a notch in a bottom surface, of said substrate, said notch being arranged such that said substrate, from a topview, intersects the microscale channel at a selected distance from the nozzle-end towards the inlet end,

the step of depositing said nozzle-forming layer comprises the steps of:

depositing, on the top surface of the substrate, a thin metal layer over the section of the microscale channel, using a shade-mask, whereby the deposited metal layer will act as a seed-layer for electroplating;

depositing a positive photoresist-layer to form a thin resist on the top surface of the substrate and to form a thick resist to cover and fill the microscale channel using a doctor-blade applying technique;

soft baking of the substrate;

exposing the substrate without a mask, such that the thin resist on the top surface of the substrate is fully exposed together with the thick resist covering the microscale channel, but the thick resist in the microscale channel remains unexposed;

developing the photoresist-layer, whereby the thin resist on the top surface of the substrate is removed, but the thick resist in the microscale channel remains;

removing parts of the metal seed-layer not covered by the photoresist-layer;

exposing the remaining photoresist-layer through a shadow-mask defining the section of the microscale channel, where the nozzle-forming layer is to be deposited;

developing the photoresist-layer, whereby the thin resist in exposed areas is removed; and

electroplating a 5–10 μm nozzle-forming metal layer to form said nozzle-forming layer in parts of the microscale channel free of the photoresist-layer, and

the step of removing material from the substrate further comprises a step of breaking the substrate along the notch.

10. The method according to any of claim 1 or 2 , wherein the microscale channel terminates at the nozzle-end.

11. The method according to any of claim 1 or 2 , wherein the microscale channel extends past the nozzle-end.