Semiconductor integrated circuit device
View Patent ↗The invention intends to provide a technique that achieves a sufficient phase margin with ease. The circuit includes a power supply circuit that is formed with a phase compensating resistor and a phase compensating capacitor, between a second input terminal of a differential amplifier and a low supply voltage. Thereby, the first pole frequency in the overall gain is determined by the first pole frequency in the voltage-dividing resistor stage in the Bode diagram for the pole/zero compensation, which is shifted to a lower frequency. Also, the zero point cancels the first pole frequency in the differential amplifier stage, which reduces the phase delay to secure the phase margin. And, since the phase compensating resistor can take a considerably high resistance, the same characteristic can be achieved with a low capacitance of the phase compensating capacitor; thereby, the phase compensation becomes possible with a resistor and a capacitor having a smaller size than the pole/zero compensation with the internal supply voltage.
1. A semiconductor integrated circuit device which has a power supply circuit, the power supply circuit comprising:
a differential amplifier including a first input terminal, a second input terminal, and an output terminal, being supplied with a high supply voltage and a low supply voltage having a voltage lower than the high supply voltage, which amplifies a difference of an input signal from the first input terminal and an input signal from the second input terminal and outputs the difference as an output signal;
a transistor that is controlled on the basis of the output signal, and generates a voltage different from the high supply voltage and the low supply voltage;
a first resistor connected between the output terminal of the transistor and the second input terminal of the differential amplifier; and
a second resistor connected between the second input terminal of the differential amplifier and the low supply voltage to form a voltage-dividing resistor stage with the first resistor,
wherein the power supply circuit includes a first phase compensating capacitor whose one end is coupled to the low supply voltage and the other end is connected to the voltage-dividing resistor stage and the second input terminal of the differential amplifier.
2. A semiconductor integrated circuit device according to claim 1 , further comprising a reference voltage generation circuit that generates a reference voltage, wherein the reference voltage is supplied to the first input terminal.
3. A semiconductor integrated circuit device according to claim 1 , wherein the power supply circuit includes a first phase compensating resistor provided between the second input terminal and the first phase compensating capacitor.
4. A semiconductor integrated circuit device which has a power supply circuit, the power supply circuit comprising:
a differential amplifier including a first input terminal, a second input terminal, and an output terminal, being supplied with a high supply voltage and a low supply voltage having a voltage lower than the high supply voltage, which amplifies a difference of an input signal from the first input terminal and an input signal from the second input terminal and outputs the difference as an output signal;
a transistor that is controlled on the basis of the output signal, and generates a voltage different from the high supply voltage and the low supply voltage;
a first resistor connected between the output terminal of the transistor and the second input terminal of the differential amplifier; and
a second resistor connected between the second input terminal of the differential amplifier and the low supply voltage to form a voltage-dividing resistor stage with the first resistor,
wherein the power supply circuit includes a first phase compensating capacitor whose one end is coupled to the low supply voltage and the other end is connected to the voltage-dividing resistor stage and the second input terminal of the differential amplifier,
wherein a second phase compensating capacitor whose one end is supplied with the voltage from the transistor and the other end is supplied with the low supply voltage, and a second phase compensating resistor connected in series thereto are provided between an output terminal of the transistor and the second phase compensating capacitor.
5. A semiconductor integrated circuit device according to claim 1 , wherein a capacitor for reducing a phase delay in the high frequency is provided between the output terminal of the transistor and the second input terminal of the differential amplifier.
6. A semiconductor integrated circuit device according to claim 3 , wherein the first phase compensating resistor uses a resistance of a metal wiring.
7. A semiconductor integrated circuit device according to claim 3 , wherein the first phase compensating resistor is a resistor using a diffusion layer formed on a semiconductor substrate.
8. A semiconductor integrated circuit device according to claim 3 , wherein the first phase compensating resistor is a resistor using a conductive layer formed on a semiconductor substrate.
9. A semiconductor integrated circuit device according to claim 8 , wherein the conductive layer is a poly-silicon layer.
10. A semiconductor integrated circuit device according to claim 1 , wherein the first phase compensating capacitor is a capacitor using an oxide film formed on a semiconductor substrate as a dielectric.
11. A semiconductor integrated circuit device according to claim 1 , wherein the first phase compensating capacitor is a capacitor using an insulating film formed on a semiconductor substrate as a dielectric.
12. A semiconductor integrated circuit device according to claim 11 , wherein the insulating film is a gate oxide film.
13. A semiconductor integrated circuit device according to claim 1 , further comprising a memory block with plural memory cells arrayed, and an internal circuit disposed adjacently to the memory block, to which an operational voltage is supplied from the power supply circuit.
14. A semiconductor integrated circuit device according to claim 13 , wherein the memory cells are of a static type memory cell.
15. A semiconductor integrated circuit device according to claim 13 , wherein the memory cells are of a dynamic type memory cell.