IP Library Granted Patent US 7,435,072
Granted Patent B2
US 7,435,072 · App. 10/453,113 · Granted Oct 14, 2008

Methods and systems for producing an object through solid freeform fabrication

Assignee: Hewlett-Packard Development Company, L.P.
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Quick Facts
Patent No.
US 7,435,072
App. No.
10/453,113
Granted
Oct 14, 2008
Kind
B2
Abstract

A method of producing an object through solid freeform fabrication, the method including fabricating a support structure about at least a portion of the object by applying a binder or focused energy to a build material.

Claims (20)

1. A solid freeform fabrication system comprising:

a fabrication bin containing a quantity of build material;

a movable stage for distributing successive layers of said build material in said fabrication bin to form an object;

a binder device configured to selectively apply a binder or focused energy to said build material in said fabrication bin to build said object;

said object being at least partially formed by said binder device from said build material in said fabrication bin and being disposed in said fabrication bin; and

a support structure being at least partially formed from said build material in said fabrication bin by said binder device, said support structure being disposed about at least a portion of said object being formed so as to prevent shifting of said build material which would degrade said object being formed.

2. The system of claim 1 , wherein said binder device comprises a liquid ejection apparatus comprising inkjet technology.

3. The system of claim 1 , wherein said support structure comprises one or more pillars disposed below said object.

4. The system of claim 3 , wherein one or more of said pillars are discontinuous, having individual portions separated from each other and at least one voxel of unbound build material positioned between said portions.

5. The system of claim 3 , wherein said pillars are sparsely arranged and comprise an aggregate footprint area of about 10-100% of an object footprint area.

6. The apparatus system of claim 1 , wherein said support structure comprises a wall disposed around at least a portion of said object.

7. The system of claim 6 , wherein said support structure comprises discontinuous walls having individual portions separated from each other and at least one voxel of unbound build material positioned between said portions.

8. The system of claim 1 , wherein said support structure comprises one or more structures disposed between adjacent features of said object.

9. The system of claim 1 , wherein said binder device emits focused energy to sinter said build material.

10. The system of claim 1 , further comprising a layer of unbound build material between said object being built and said support structure.

11. The system of claim 10 , wherein said layer of unbound build material corresponds to a size of a voxel of said object being built.

12. The system of claim 1 , further comprising a layer of unbound build material between said support structure and a base of said fabrication bin.

13. The system of claim 12 , wherein said layer of unbound build material corresponds to a size of a voxel of said object being built.

14. The system of claim 1 , wherein said binder device is further programmed to minimize an amount of time required to build said support structure.

15. The system of claim 3 , wherein said one or more pillars comprise a plurality of separate pillars built below said object.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2025
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PERIDOT PRINT LLC
Reel/Frame 070187/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2003
From: COLLINS, DAVD C; HUNTER, SHAWN D; NIELSEN, JEFFREY ALLEN
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 014194/0332 →
Continuity (1)
Related Publication 20040239009A1 · Dec 2, 2004