Method of forming patterned films
View Patent ↗This method forms a patterned film. The method prepares a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed, performs stripping treatment on surfaces of at least ridges formed on the transfer surface of the transfer member, thereafter forms a thin film formed by a technology of vacuum film formation on the surfaces of the at least ridges formed on the transfer surface of the transfer member and transfers the thin film formed on the surfaces of at least ridges of the transfer member onto a substrate, thereby forming the patterned film on the substrate.
1. A patterned film forming method, comprising steps of:
preparing a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed;
performing stripping treatment on surfaces of at least ridges formed on said transfer surface of said transfer member;
thereafter forming a thin film formed by a technology of vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member; and
transferring said thin film formed on said surfaces of said at least ridges of said transfer member onto a substrate, thereby forming a patterned film on said substrate,
wherein said vacuum film formation is performed on a surface of a suitable member by said technology of said vacuum film formation and subsequently transferred to said surfaces of said at least ridges of said transfer surface of said transfer member, thereby forming said thin film formed by said technology of said vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member.
2. A patterned film forming method, comprising steps of:
preparing a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed;
performing stripping treatment on surfaces of at least ridges formed on said transfer surface of said transfer member;
thereafter forming a thin film formed by a technology of vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member; and
transferring said thin film formed on said surfaces of said at least ridges of said transfer member onto a substrate, thereby forming a patterned film on said substrate,
wherein said patterned film formed on said substrate is a conductive film, and
wherein said stripping treatment comprises subjecting the surfaces of the ridges to plasma treatment or corona discharge.
3. The patterned film forming method according to claim 2 , wherein said vacuum film formation is performed on said transfer surface of said transfer member on which the asperities are formed, thereby forming said thin film formed by said technology of said vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member.
4. The patterned film forming method according to claim 1 , wherein said stripping treatment comprises forming one of a metal oxide film and a carbon film on surfaces of at least ridges formed on said transfer surface of said transfer member.
5. The patterned film forming method according to claim 1 , wherein said stripping treatment comprises subjecting the surfaces of the ridges to plasma treatment.
6. The patterned film forming method according to claim 1 , wherein said stripping treatment comprises subjecting the ridges to corona discharge.
7. The patterned film forming method according to claim 1 , wherein said patterned film formed on said substrate is a transparent conductive film.
8. The patterned film forming method according to claim 1 , wherein said patterned film formed on said substrate is a light-emitting layer.
9. The patterned film forming method according to claim 1 , wherein said patterned film is a transparent conductive film, said substrate is transparent, and said method comprises forming a transparent conductive film on the transparent substrate.
10. The patterned film forming method according to claim 1 , wherein said patterned film is a color light-emitting layer, said substrate is a light-emitting plate, and said method comprises forming said color light-emitting layer on said light-emitting plate.
11. The patterned film forming method according to claim 2 , wherein said vacuum film formation is performed on a surface of a suitable member by said technology of said vacuum film formation and subsequently transferred to said surfaces of said at least ridges of said transfer surface of said transfer member, thereby forming said thin film formed by said technology of said vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member.
12. The patterned film forming method according to claim 2 ,
wherein said patterned film formed on said substrate is a transparent conductive film that is made of a material selected from the group consisting of indium-tin oxide, zinc oxide and titanium nitride.
13. The patterned film forming method according to claim 2 , wherein said patterned film is a transparent conductive film, said substrate is transparent, and said method comprises forming said transparent conductive film on said transparent surface.
14. A patterned film forming method, comprising steps of:
preparing a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed;
performing stripping treatment on surfaces of at least ridges formed on said transfer surface of said transfer member;
thereafter forming a thin film formed by a technology of vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member; and
transferring said thin film formed on said surfaces of said at least ridges of said transfer member onto a substrate, thereby forming a patterned film on said substrate,
wherein said patterned film formed on said substrate is a light-emitting layer.
15. The patterned film forming method according to claim 14 , wherein said vacuum film formation is performed on said transfer surface of said transfer member on which the asperities are formed, thereby forming said thin film formed by said technology of said vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member.
16. The patterned film forming method according to claim 14 , wherein said vacuum film formation is performed on a surface of a suitable member by said technology of said vacuum film formation and subsequently transferred to said surfaces of said at least ridges of said transfer surface of said transfer member, thereby forming said thin film formed by said technology of said vacuum film formation on said surfaces of said at least ridges formed on said transfer surface of said transfer member.
17. The patterned film forming method according to claim 14 , wherein said stripping treatment comprises forming one of a metal oxide film and a carbon film on surfaces of at least ridges formed on said transfer surface of said transfer member.
18. The patterned film forming method according to claim 14 , wherein said stripping treatment comprises subjecting the surfaces of the ridges to plasma treatment or corona discharge.
19. The patterned film forming method according to claim 14 , wherein said patterned film is a color light-emitting layer, said substrate is a light-emitting plate, and said method comprises forming said color light-emitting layer on said light-emitting plate.
20. The patterned film forming method according to claim 2 ,
wherein said patterned film formed on said substrate is a conductive film which is transparent to the extent that it can be used as a TFT element requiring a transparent electrode.