IP Library Granted Patent US 7,079,390
Granted Patent B2
US 7,079,390 · App. 10/456,671 · Granted Jul 18, 2006

System and method for heat dissipation and air flow redirection in a chassis

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Quick Facts
Patent No.
US 7,079,390
App. No.
10/456,671
Granted
Jul 18, 2006
Kind
B2
Abstract

An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.

Claims (26)

1. An apparatus for heat dissipation in a chassis housing an electronic system, comprising:

a heat sink base for collecting thermal heat; and

a plurality of curvilinearly shaped fins thermally coupled to said heat sink base for dissipating said thermal heat, said plurality of curvilinearly shaped fins arranged in said chassis to redirect air flow from a first direction originally directed at said plurality of curvilinearly shaped fins to a second direction that is uniform, wherein said second direction varies from said first direction in an x-direction, a y-direction, and a z-direction.

2. The apparatus as described in claim 1 , further comprising:

an air accelerator enclosed within said chassis for providing said air flow in said first direction.

3. The apparatus as described in claim 1 , wherein each of said plurality of curvilinearly shaped fins has a substantially linear shape such that each of said plurality of curvilinearly shaped fins is arranged substantially at an angle to said first direction for redirecting said air flow to said second direction.

4. The apparatus as described in claim 1 , wherein each of said plurality of curvilinearly shaped fins

is arranged on said heat sink base to gradually redirect said air flow from said first direction to said second direction.

5. The apparatus as described in claim 1 , wherein said second direction varies from said first direction in a three dimensional space.

6. The apparatus as described in claim 1 , further comprising:

a plurality of fins, including said fin, thermally coupled to said heat sink base for dissipating said thermal heat, each of said plurality of fins arranged on said heat sink base to redirect said air flow.

7. An apparatus for heat dissipation enclosed within a chassis, comprising:

a heat source emanating thermal heat;

a heat sink base thermally coupled to said heat source for collecting said thermal heat;

an air accelerator for generating forced air flow;

a plurality of curvilinearly shaped fins thermally coupled to said heat sink base for dissipating said thermal heat, each of said plurality of curvilinearly shaped fins arranged within said chassis to redirect said forced air flow from a first direction originally directed at said plurality of curvilinearly shaped fins to a second direction, wherein said second direction varies from said first direction in an x-direction, a y-direction, and a z-direction, and wherein said plurality of curvilinearly shaped fins is arranged to redirect said forced air flow to bypass a blocking structure.

8. The apparatus as described in claim 7 , wherein said heat source is a central processing unit.

9. The apparatus as described in claim 7 , wherein said chassis houses an electrical system.

10. The apparatus as described in claim 7 , wherein said chassis comprises an 1U server chassis.

11. The apparatus as described in claim 7 , wherein said plurality of curvilinearly shaped fins is arranged to redirect said forced air flow towards a second element for purposes of dissipating a second thermal heat originating from said second element.

12. A method for heat dissipation in a chassis housing an electronic system, comprising:

a) generating forced air flow within an enclosure;

b) dissipating thermal heat generated by a heat source by directing said forced air flow in a first direction at a plurality of curvilinearly shaped fins that is thermally coupled to a heat sink base, wherein said heat sink base is thermally coupled to said heat source and collects said thermal heat; and

c) arranging said plurality of curvilinearly shaped fins in said chassis to redirect said forced air flow from said first direction to a second direction to bypass a blocking structure, wherein said second direction varies from said first direction in an x-direction, a y-direction, and a z-direction.

13. The method as described in claim 12 , wherein c) further comprises:

uniformly varying said first direction from said second direction in a three dimensional space.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2022
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 061244/0298 →
PATENT ASSIGNMENT, SECURITY INTEREST, AND LIEN AGREEMENT Recorded Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2003
From: BARR, ANDREW HARVEY; BARSUN, STEPHEN KARL; DOBBS, ROBERT WILLIAM
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013992/0773 →