Integrated lead suspension and method of construction
View Patent ↗An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
1. An integrated lead suspension, comprising:
a lead wiring pad provided on a flexure section of the suspension, a bonding pad provided on a slider of a head gimbal section of the suspension, and a solder ball that is placed between the lead wiring pad and the bonding pad, so that the solder ball is melted to solder the lead wiring pad and the bonding pad together; and wherein
the lead wiring pad comprises a recessed section into which the solder ball is dropped, using gravitational force, and rolled along a center line of the surface of the lead wiring pad into contact with the bonding pad, such that the solder ball remains in the recessed section from an initial position that is out of contact with the bonding pad to a terminal position that is in contact with the bonding pad wherein, the recessed section comprises a recess extending along the centerline of the pad.
2. The integrated lead suspension of claim 1 , wherein in the recessed section, a difference in level is provided between a portion into which the solder ball is dropped and portions on both sides of said portion.
3. The integrated lead suspension of claim 1 , wherein in the recessed section, distances from the center line of a portion into which the solder ball is dropped to both sides of the recessed section are equal.
4. The integrated lead suspension of claim 1 , wherein the lead wiring pad provides both structural support for and electrical connection with the solder ball.
5. An integrated lead suspension, comprising:
a lead wiring pad provided on a flexure section of the suspension, a bonding pad provided on a slider of a head gimbal section of the suspension, and a solder ball that is placed between the lead wiring pad and the bonding pad, so that the solder ball is melted to solder the lead wiring pad and the bonding pad together; wherein
the lead wiring pad comprises a recessed section into which the solder ball is dropped, using gravitational force, adjacent to a center line of the surface of the lead wiring pad; and wherein
in the recessed section, a portion into which the solder ball is dropped has a groove shape that is parallel to the center line.
6. The integrated lead suspension of claim 5 , wherein the lead wiring pad provides both structural support for and electrical connection with the solder ball.
7. An integrated lead suspension, comprising:
a lead wiring pad on a flexure section of the suspension and having a center line, a bonding pad on a slider of a head gimbal section of the suspension, and a solder ball placed between the lead wiring pad and the bonding pad, the solder ball being melted to solder the lead wiring pad and the bonding pad together; and
a recess in the lead wiring pad extending along the center line, the recess permitting motion of the solder ball along the center line, and the recess restricting motion of the solder ball in a direction perpendicular to the center line and the bonding pad.
8. The integrated lead suspension of claim 7 , wherein the recess is an elongated rectangular notch formed in a surface of the lead wiring pad.
9. The integrated lead suspension of claim 7 , wherein the lead wiring pad has a length in a direction of the of the center line, a width that is transverse to the length, and a thickness that is transverse to both the length and the width, the recess has a width, that is approximately half of the width of the lead wiring pad, and the recess has a thickness that is approximately half of the thickness of the lead wiring pad.
10. The integrated lead suspension of claim 7 , wherein the lead wiring pad provides both structural support for and connection with the solder ball.