IP Library Granted Patent US 7,048,359
Granted Patent B2
US 7,048,359 · App. 10/459,864 · Granted May 23, 2006

Ink-jet printhead and method for producing the same

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Quick Facts
Patent No.
US 7,048,359
App. No.
10/459,864
Granted
May 23, 2006
Kind
B2
Abstract

An ink-jet printhead is provided having a thin film substrate comprising a plurality of thin film layers; a plurality of ink firing heater resistors defined in said plurality of thin film layers; a polymer fluid barrier layer; and a carbon rich layer disposed on said plurality of thin film layers, for bonding said polymer fluid barrier layer to said thin film substrate.

Claims (36)

1. A thin film printhead, comprising:

a thin film substrate comprising a plurality of thin film layers, said thin film layers including a patterned gold layer;

a plurality of ink firing heater resistors defined in said plurality of thin film layers;

a polymer fluid barrier layer; and

a diamond like carbon layer disposed on said plurality of thin film layers, with said polymer fluid barrier layer disposed directly on said diamond like carbon layer, said diamond like carbon layer bonding said polymer fluid barrier layer to said thin film substrate, such that said diamond like carbon layer is formed between said plurality of ink firing heater resistors and said polymer fluid barrier layer, said diamond like carbon layer extending over the patterned gold layer, the diamond like carbon layer formed both in those areas of said thin film layers that form said ink firing heater resistors and in those areas of said thin film layers that do not form said ink firing heater.

2. The thin film printhead of claim 1 , further comprising an adhesion promoter layer between said diamond like carbon layer and said plurality of thin film layers.

3. The thin film printhead of claim 1 , wherein said diamond like carbon layer comprises at least 25% elemental carbon.

4. The thin film printhead of claim 3 , wherein said diamond like carbon layer comprises from about 35% to about 100% elemental carbon.

5. The thin film printhead of claim 4 , wherein said diamond like carbon layer comprises from about 75% to about 100% elemental carbon.

6. The thin film printhead of claim 1 , wherein the diamond like carbon layer comprises carbon having an sp 2 to sp 3 ratio m the range from about 1:1.5 to about 1:9.

7. The thin film printhead of claim 6 , wherein the diamond like carbon layer comprises carbon having an sp 2 to sp 3 ratio in the range from about 1:2.0 to about 1:2.4.

8. The thin film printhead of claim 7 , wherein the diamond like carbon layer comprises carbon having an sp 2 to sp 3 ratio m the range from about 1:2.2 to about 1:2.3.

9. The thin film printhead of claim 1 , wherein said diamond like carbon layer is formed by passing carbon containing gas over said substrate such that the diamond like carbon layer is formed on said substrate.

10. The thin film printhead of claim 9 , wherein said carbon containing gas is methane.

11. The thin film printhead of claim 1 , wherein said diamond like carbon layer is formed by a plasma enhanced chemical vapor deposition method.

12. The thin film printhead of claim 1 , wherein the diamond like carbon layer formed in those areas of said thin film layers that do not form said ink firing heater resistors reduces delamination.

13. A thin film printhead, comprising:

a thin film substrate comprising a plurality of thin film layers, said thin film layers including a patterned gold layer;

a plurality of ink firing heater resistors defined in said plurality of thin film layers;

a polymer fluid barrier layer; and

a diamond like carbon layer disposed on said plurality of thin film layers, with said polymer fluid barrier layer disposed directly on said diamond like carbon layer, said diamond like carbon layer bonding said polymer fluid barrier layer to said thin film substrate, such that said diamond like carbon layer is formed between said plurality of ink firing heater resistors and said polymer fluid barrier layer, said diamond like carbon layer extending over the patterned gold layer, the diamond like carbon layer formed both in those areas of said thin film layers that form said ink firing heater resistors and in those areas of said thin film layers that do not form said ink firing heater resistors;

said diamond like carbon layer having been formed by

inserting said substrate into a plasma enhanced chemical vapor deposition chamber;

evacuating the chamber;

introducing into the chamber a noble gas and a carbon containing gas;

delivering power to the chamber;

maintaining power for a certain length of time sufficient to allow for formation of said carbon layer on said substrate;

evacuating the chamber;

venting the chamber with a noble gas;

removing said substrate with the deposited diamond like carbon layer from the chamber.

14. The thin film printhead of claim 13 , wherein the plasma enhanced chemical vapor deposition chamber is a parallel plate chamber.

15. A thin film printhead, comprising:

a thin film substrate comprising a plurality of thin film layers, said thin film layers including a patterned gold layer;

a plurality of ink ejection elements defined in said plurality of thin film layers;

a polymer fluid barrier layer; and

a diamond like carbon layer disposed on said plurality of thin film layers, with said polymer fluid barrier layer disposed directly on said diamond like carbon layer, said diamond like carbon layer bonding said polymer fluid barrier layer to said thin film substrate, such that said diamond like carbon layer is formed between said plurality of ink firing heater resistors and said polymer fluid barrier layer, said diamond like carbon layer extending over the patterned gold layer, the diamond like carbon layer formed both in those areas of said thin film layers that form said ink firing heater resistors and in those areas of said thin film layers that do not form said ink firing heater resistors.