IP Library Granted Patent US 8,328,564
Granted Patent B2
US 8,328,564 · App. 10/461,296 · Granted Dec 11, 2012

Electrical connector solder terminal

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Quick Facts
Patent No.
US 8,328,564
App. No.
10/461,296
Granted
Dec 11, 2012
Kind
B2
Abstract

A connector is provided for mounting a module to a printed circuit board. The connector includes a housing having end walls defining a slot for receiving a module. Terminals are mounted within the housing on either side of the slot. Each terminal includes a tail. A solder mass is attached to each tail and is used to bond the connector to the printed circuit board. The solder mass is attached to each tail without the use of a reflow process. The solder mass can be attached to the tail of the terminal either through a mechanical attachment or through bonding. A reflow process is then used to attach the connector to the printed circuit board.

Claims (14)

1. An electrical connector, comprising:

a housing;

at least one terminal mounted in said housing, said terminal including a contact portion and a tail portion;

at least one solder mass to be retainingly attached to said tail portion, the retention of the solder mass to the tail portion being enhanced by a plating that covers the solder mass and the tail portion.

2. A connector comprising:

a housing;

at least one terminal mounted in said housing, said terminal including a contact portion and a tail portion;

at least one solder mass attached to said tail portion; and

plating substantially covering said tail portion and said solder mass to enhance the attachment of the solder mass to the tail portion.

3. The connector as defined in claim 2 , wherein said solder mass is mechanically attached to said tail portion.

4. The connector as defined in claim 2 , wherein said solder mass is bonded to said tail portion.

5. An electrical terminal, the terminal comprising:

a contact portion and a tail portion; and

at least one solder mass to be retainingly attached to said tail portion, the retention of the solder mass to the tail portion being enhanced by a plating that covers the solder mass and the tail portion.

Assignments (2)
CHANGE OF NAME Recorded Feb 22, 2023
From: MOLEX INCORPORATED
To: MOLEX, LLC
Reel/Frame 062820/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2003
From: REGNIER, KENT E.; ZADEREJ, VICTOR
To: MOLEX INCORPORATED
Reel/Frame 014211/0882 →