Configuration and method for mounting a backing film to a polish head
View Patent ↗By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.
1. A method for mounting a backing film having an adhesive layer, the method which comprises:
providing a polish head having a surface for contacting the backing film, the surface of the polish head formed with vacuum holes;
holding the polish head;
aligning the backing film to the vacuum holes formed in the polish head;
covering the surface of the polish head with the backing film;
heating the backing film, while holding a heating temperature substantially constant or below a threshold value using a control unit and a temperature measuring sensor; and
exerting a uniform pressure force on the backing film perpendicular to the surface of the polish head, with a device moveable relative to the surface of the polish head.
2. The method according to claim 1 , which comprises performing the step of exerting the uniform pressure force by rolling a roller across the surface of the polish head covered by the backing film.
3. The method according to claim 2 , which comprises measuring a temperature of the roller and adjusting the heating temperature in response to a signal from the temperature measuring sensor.
4. The method according to claim 2 , which comprises when performing the step of covering the surface of the polish head with the backing film, measuring a pressure force exerted on the surface of the polish head and adjusting the pressure force in response to a signal from a sensor for measuring the pressure force.
5. The method according to claim 1 , which comprises performing the step of exerting the uniform pressure force by pressing a plate onto the surface of polish head covered by the backing film.
6. The method according to claim 5 , which comprises measuring a temperature of the plate and adjusting the heating temperature in response to a signal from the temperature measuring sensor.
7. A configuration for mounting a backing film having an adhesive layer, the configuration comprising:
a device for holding polish head having a surface formed with a plurality of vacuum holes;
a device for aligning the hacking film to the vacuum holes formed in the polish head;
a pressure exerting device for exerting a uniform pressure force on the surface of the polish head when the surface of the polish head is being covered by the backing film;
a device for heating the backing film;
said pressure exerting device including a roller having an axis parallel to the surface of the polish head; and
said pressure exerting device including a roller guide for guiding said roller parallel to the surface of the polish head when the polish head is held by the device for holding the polish head.
8. The configuration according to claim 1 , wherein at least one component selected from a group consisting of said roller guide and said device for holding the polish head includes a device for adjusting a distance between the axis of said roller and the surface of the polish head.
9. The configuration according to claim 1 , further comprising:
an energy source and a motor for moving said roller;
said motor connected to said roller guide.
10. The configuration according to claim 1 , wherein the polish head is configured for polishing semiconductor wafers.
11. The configuration according to claim 1 , wherein:
said device for heating is configured for heating said pressure exerting device for melting the adhesive layer; and
said pressure exerting device includes at least one sensor for measuring a temperature.
12. The configuration according to claim 11 , further comprising a control unit connected to at least one component selected from a group consisting of said sensor for measuring the temperature, said device for heating, and said pressure exerting device.
13. The configuration according to claim 1 , wherein at least one component selected from a group consisting of said device for holding the polish head and said pressure exerting device includes at least one sensor for measuring a pressure force exerted on the surface of the polish head being covered by the backing film.
14. The configuration according to claim 13 , further comprising a control unit connected to at least one component selected from a group consisting of said sensor for measuring the temperature, said device for heating, said sensor for measuring the pressure force, and said pressure exerting device.
15. A configuration according to claim 1 , wherein said device for heating is configured for heating the polish head.
16. A configuration for mounting a backing film having an adhesive layer, the configuration comprising:
a device for holding a polish head having a surface formed with a plurality of vacuum holes;
a device for aligning the backing film to the vacuum holes formed in the polish head;
a pressure exerting device for exerting a uniform pressure force on the surface of the polish head when the surface of the polish head is being covered by the backing film;
a device for heating the backing film;
said pressure exerting device including a plate having a surface parallel to the surface of the polish head; and
said pressure exerting device being moveable relative to the surface of the polish head.
17. The configuration according to claim 12 , wherein:
said device for heating is configured for heating said pressure exerting device for melting the adhesive layer; and
said pressure exerting device includes at least one sensor for measuring a temperature.
18. The configuration according to claim 16 , further comprising a control unit connected to at least one component selected from a group consisting of said sensor for measuring the temperature, said device for heating, and said pressure exerting device.
19. The configuration according to claim 16 , wherein at least one component selected from a group consisting of said device for holding the polish head and said pressure exerting device includes at least one sensor for measuring a pressure force exerted on the surface of the polish head being covered by the backing film.
20. The configuration according to claim 19 , further comprising a control unit connected to at least one component selected from a group consisting of said sensor for measuring the temperature, said device for heating, said sensor for measuring the pressure force, and said pressure exerting device.
21. A configuration according to claim 16 , wherein said device for heating is configured for heating the polish head.
22. The configuration according to claim 16 , wherein the polish head is configured for polishing semiconductor wafers.