Copper casting mold
View Patent ↗A copper casting mold for the continuous casting of steel melts is provided, in the presence of zinc and or sulfur in the thermally most greatly stressed contact region with the steel melt, with an at least single-layer diffusion barrier layer made of at least one metallic/metalloid material.
1. A copper casting mold arrangement for a continuous casting of-steel melts in a presence at least of one of zinc and sulfur, comprising:
a mold with a diffusion barrier layer in a thermally most greatly stressed contact region with the steel melt,
wherein the diffusion barrier layer includes a layer of at least one of carbides, nitrides and borides,
wherein the diffusion barrier layer is based on at least one of titanium, aluminum and chromium,
wherein the diffusion barrier layer comprises one of aluminum nitride (AIN), aluminum oxide (Al 2 O 3 ), chromium carbide (CrC), chromium nitride (CrN), titanium carbide (TiC), titanium nitride (TiN), titanium carbonitride (TiCN), titanium aluminum nitride (TiAIN) and titanium boride (TiB 2 ), and
wherein the diffusion barrier comprises a layer of chromium nitride (CrN) directly on the copper casting mold arrangement, a layer of aluminum oxide (Al 2 O 3 ) over the layer of chromium nitride (CrN) and an outer layer of titanium nitride (TiN) over the layer of aluminum oxide (Al 2 3 ).
2. The copper casting mold arrangement according to claim 1 ,
wherein the diffusion barrier layer is provided in one of an upper half of a tube mold and a plate mold.
3. The copper casting mold arrangement according to claim 1 ,
wherein the diffusion barrier layer is provided at a region of a height of a bath level of one of a tube mold and a plate mold.
4. The copper casting mold arrangement as according to claim 1 ,
wherein the diffusion barrier layer is provided over an entire circumference of a revolving mold that is in contact with a steel melt.
5. The copper casting mold arrangement according to claim 1 ,
wherein the diffusion barrier layer has a thickness of 0.002 mm through 0.3 mm.
6. The copper casting mold arrangement according to claim 1 ,
wherein the diffusion barrier layer has a thickness of 0.005 mm through 0.1 mm.
7. The copper casting mold arrangement according to claim 1 ,
wherein the diffusion barrier layer is configured as a multilayer layer.
8. The copper casting mold arrangement of claim 1 ,
wherein the diffusion barrier layer further comprises a layer of nickel.