Method for structuring a silicon layer
View Patent ↗A method for structuring a silicon layer applies lacquer mask onto the silicon layer, and the silicon layer is selectively etched relative to the lacquer mask using an etching gas mixture comprising SF 6 , HBr and He/O 2 . The openings etched into the silicon layer with this method comprise especially steep sidewalls. Over and above this, the etching selectivity relative to a lacquer mask is clearly improved.
1. A method for structuring a silicon layer, comprising:
applying a lacquer mask onto the silicon layer;
selectively etching the silicon layer relative to the lacquer mask utilizing an etching gas mixture consisting of SF 6 , HBr and a mixture of He and O 2 ;
setting a flow of SF 6 to between 3 and 7 sccm when etching the silicon layer;
setting a flow of HBr to between 170 and 210 sccm when etching the silicon layer; and
setting a flow of a mixture of He and O 2 to between 8 and 12 sccm when etching the silicon layer.
2. The method according to claim 1 , further comprising providing, as the silicon layer, a polysilicon layer or an amorphous silicon layer.
3. The method according to claim 1 , wherein the mixture of He and O 2 comprises a mixture of 70% He and 30% O 2 .
4. The method according to claim 1 , further comprising setting a pressure between 5 and 15 Pa when etching the silicon layer.
5. The method according to claim 1 , wherein the etching of the silicon layer utilizes inductively coupled plasma etching.
6. The method according to claim 5 , wherein the inductively coupled plasma etching inductively couples a power between 400 and 800 W.
7. The method according to claim 5 , further comprising providing a bias power between 40 and 100 W.
8. The method according to claim 1 , further comprising:
applying an organic anti-reflection coat onto the silicon layer; and
selectively etching the anti-reflection coat relative to the lacquer mask before applying the lacquer mask.
9. The method according to claim 8 , wherein the anti-reflection coat is etched selectively relative to the lacquer layer utilizing an etching gas comprising CF 4 .
10. The method according to claim 9 , further comprising setting a flow of CF 4 to between 80 and 120 sccm when etching the anti-reflection coat.
11. The method according to claim 9 , wherein the anti-reflection coat is etched only with CF 4 .
12. The method according to claim 9 , further comprising setting a pressure between 5 and 10 Pa when etching the anti-reflection coat.
13. The method according to claim 1 , further comprising:
applying the silicon layer onto a layer to be structured;
forming a hard mask from the silicon layer by structuring utilizing the lacquer mask; and
etching the layer to be structured utilizing the silicon layer as a hard mask.
14. The method according to claim 13 , further comprising removing the lacquer mask before the etching of the layer to be structured.
15. The method according to claim 13 , further comprising:
covering, with the layer to be structured, a semiconductor substrate into which field effects transistors are integrated; and
etching via holes to gate structures and to doping zones arranged in the substrate into the layer to be structured.
16. The method according to claim 13 , wherein openings in the silicon layer define a position of both the via holes leading to the gate structures as well as of the via holes leading to the doping zones, all openings of the silicon layer being etched by assistance of the lacquer mask.
17. The method according to claim 13 , comprising at least two etching stages for etching the via holes to the gate structures and to the doping zones, wherein individual openings of the silicon layer are covered with an auxiliary layer in at least one of the etching steps.
18. The method for structuring a silicon layer as claimed in claim 1 , wherein lower sidewalls are formed that are essentially vertical throughout a lower etched portion.