IP Library Granted Patent US 7,136,552
Granted Patent B2
US 7,136,552 · App. 10/465,300 · Granted Nov 14, 2006

TO-packaged optic-fiber receiving interface and method

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Quick Facts
Patent No.
US 7,136,552
App. No.
10/465,300
Granted
Nov 14, 2006
Kind
B2
Abstract

An optical interface between an optical fiber and a photodiode is provided. The optical fiber has an end. The optical interface includes a lens located such that a chief ray of an optical signal outputted at said end traverses a center of the lens. The lens may be a ball lens or a lens having an orientation such that the chief ray is incident substantially normal to a center of the lens.

Claims (45)

1. An optical interface between an optical fiber and a photodiode chip, said optical fiber having an end, said optical interface comprising:

a lens located such that a chief ray of an optical beam outputted at said end substantially overlaps an optical axis of the lens, and a center of the lens is on the optical axis,

wherein an imaging focal point of the lens, where the optical beam is applied, is on an upper surface of the photodiode chip, and

wherein the photodiode is offset from a centerline of the optical fiber.

2. The optical interface of claim 1 , wherein said end of the optical fiber is slanted.

3. The optical interface of claim 1 , wherein the lens comprises a ball lens.

4. The optical interface of claim 1 , wherein the photodiode chip is mounted on a TO header at an offset from a centerline of the TO header, and wherein the chief ray is applied at an active area of the photodiode chip.

5. The optical interface of claim 4 , wherein the centerline of the TO header is substantially aligned with a core of the optical fiber.

6. The optical interface of claim 4 , wherein the centerline of the TO header is substantially aligned with a center of the lens.

7. The optical interface of claim 4 , wherein a distance between the TO header centerline and a center of the active area of the photodiode chip is twice of a second distance between the TO header centerline and a center of the lens.

8. The optical interface of claim 1 , further comprising a lens holder on which the lens is mounted.

9. The optical interface of claim 1 , wherein the photodiode chip includes a PIN diode or an APD diode.

10. The optical interface of claim 1 , wherein the photodiode chip is mounted on the TO header at an angle so as to reduce reflection of the optical beam back to the slanted end of the optical fiber.

11. An optical assembly comprising:

an optical fiber having a core and an end;

a photodiode chip having an active area; and

a lens disposed between the optical fiber and the photodiode chip, the lens being located such that a chief ray of an optical beam outputted at said end substantially overlaps an optical axis of the lens, and a center of the lens is on the optical axis,

wherein an imaging focal point of the lens, where the optical beam is applied, is on an upper surface of the photodiode chip, and

wherein the photodiode is offset from a centerline of the optical fiber.

12. The optical assembly of claim 11 , wherein said end of the optical fiber is slanted.

13. The optical assembly of claim 11 , wherein the lens comprises a ball lens.

14. The optical assembly of claim 11 , further comprising a TO header, wherein the photodiode chip is mounted on the TO header at an offset from a centerline of the TO header, and wherein the chief ray is applied at the active area of the photodiode chip.

15. The optical assembly of claim 14 , wherein the centerline of the TO header is substantially aligned with the core of the optical fiber.

16. The optical assembly of claim 14 , wherein the centerline of the TO header is substantially aligned with a center of the lens.

17. The optical assembly of claim 14 , wherein a distance between the TO header centerline and a center of the active area of the photodiode chip is twice of a second distance between the TO header centerline and a center of the lens.

18. The optical assembly of claim 11 , further comprising a lens holder on which the lens is mounted.

19. The optical assembly of claim 11 , wherein the photodiode chip includes a PIN diode or an APD diode.

20. The optical assembly of claim 11 , wherein the photodiode chip is mounted on the TO header at an angle so as to reduce reflection of the optical beam back to the slanted end of the optical fiber.

21. A method of using a photodiode chip having an active area to detect a chief ray of an optical beam outputted at an end of an optical fiber, said end having a surface, the method comprising:

slanting said end of the optical fiber such that the chief ray is outputted at an angle with respect to the surface of said end;

placing a lens such that the chief ray of the optical beam substantially overlaps an optical axis of the lens, and a center of the lens is on the optical axis; and

placing the photodiode chip such that the chief ray can be incident on the active area of the photodiode chip substantially unbent,

wherein an imaging focal point of the lens, where the optical beam is applied, is on an upper surface of the photodiode chip, and

wherein the photodiode is offset from a centerline of the optical fiber.

22. The method of claim 21 , wherein the lens comprises a ball lens.

23. In an optical assembly comprising an optical fiber and an opto-electronic device chip, a method of improving coupling efficiency between the optical fiber and the opto-electronic device chip, the method comprising:

slanting an edge of the optical fiber that optically interfaces with the opto-electronic device chip; and

placing the opto-electronic device chip such that a chief ray of an optical beam can travel between said slanted edge of the optical fiber and the opto-electronic device chip substantially unbent,

wherein the chief ray substantially overlaps an optical axis of a lens disposed between the optical fiber and the opto-electronic device chip, and a center of the lens is on the optical axis, and

wherein an imaging focal point of the lens, where the optical beam is applied, is on an upper surface of the opto-electronic device chip, and

wherein the the opto-electronic device chip is offset from a centerline of the optical fiber.

24. The method of claim 23 , wherein an off-axis aberration reduced by substantially overlapping the chief ray with the optical axis of the lens comprises at least one of coma and astigmatism.

25. The method of claim 23 , wherein the opto-electronic device chip comprises a photodiode chip capable of detecting the optical beam outputted at said slanted edge of the optical fiber.

26. The optical interface of claim 1 , wherein the optical beam is incident at substantially the center of the photodiode chip.

27. The optical interface of claim 1 , wherein when the optical axis of the lens is aligned to match the chief ray which is obliquely incident, the photodiode chip is relatively aligned with an angle at the imaging focal point, wherein the photodiode chip is tilted in relation to a header to lower an optical return loss of the optical beam.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Aug 25, 2025
From: WINGSPIRE CAPITAL LLC
To: EMCORE CORPORATION
Reel/Frame 072106/0561 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2022
From: WELLS FARGO BANK
To: EMCORE CORPORATION; EMCORE SOLAR POWER, INC.
Reel/Frame 061212/0728 →
SECURITY INTEREST Recorded Aug 23, 2022
From: EMCORE CORPORATION
To: WINGSPIRE CAPITAL LLC
Reel/Frame 061300/0129 →