IP Library Granted Patent US 6,954,129
Granted Patent B2
US 6,954,129 · App. 10/470,005 · Granted Oct 11, 2005

Wire core inductive devices having a flux coupling structure and methods of making the same

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Quick Facts
Patent No.
US 6,954,129
App. No.
10/470,005
Granted
Oct 11, 2005
Kind
B2
Abstract

An inductive device ( 10 ) comprises a magnetic core ( 16 ) including a portion of a plurality of wires ( 18 ), an electric winding ( 20 ) extending around said magnetic core, with one or more of the plurality of wires ( 18 ) at least partially encircling the electric winding ( 20 ) and having first and second end portions ( 26 ) arranged so as to form a gap ( 24 ) therebetween, and a flux coupling structure ( 28 ) disposed in a vicinity of the gap ( 24 ) so as to enhance coupling of magnetic flux between the first and second end portions ( 26 ).

Claims (47)

1. An inductive device comprising:

a magnetic core including a portion of a plurality of wires;

an electric winding extending around said magnetic core, with one or more of said plurality of wires at least partially encircling said electric winding and having first and second end portions arranged so as to form a gap therebetween; and

a flux coupling structure disposed in a vicinity of said gap so as to enhance coupling of magnetic flux between said first and second end portions.

2. An inductive device as recited in claim 1 , wherein said at least one flux coupling structure is disposed in said gap.

3. An inductive device as recited in claim 1 , wherein said flux coupling structure is disposed adjacent said gap.

4. An inductive device as recited in claim 1 , wherein said flux coupling structure spans a width of said gap.

5. An inductive device as recited in claim 4 , wherein said flux coupling structure is disposed in said gap.

6. An inductive device as recited in claim 5 , wherein said flux coupling structure is press fitted in said gap.

7. An inductive device as recited in claim 4 , wherein said flux coupling structure is disposed adjacent to said gap.

8. An inductive device as recited in claim 4 , wherein said flux coupling structure is in contact with said first and second end portions.

9. An inductive device as recited in claim 1 , wherein said flux coupling structure occupies only part of a width of said gap.

10. An inductive device as recited in claim 1 , wherein said gap is formed between opposed end faces of first and second end portions.

11. An inductive device as recited in claim 10 , wherein said end faces are spaced from one another.

12. An inductive device as recited in claim 10 , wherein said end faces are abutted with one another.

13. An inductive device as recited in claim 1 , wherein said end portions are overlapped with one another.

14. An inductive device as recited in claim 1 , wherein said flux coupling structure is a band.

15. An inductive device as recited in claim 1 , wherein said flux coupling structure includes at least one wire.

16. An inductive device as recited in claim 1 , wherein said flux coupling structure includes a plate.

17. An inductive device as recited in claim 16 , wherein said flux coupling structure is annular.

18. An inductive device as recited in claim 1 , wherein said flux coupling structure includes a plurality of wire segments.

19. An inductive device as recited in claim 18 , wherein said plurality of wire segments includes wire segments of different cross-sectional shapes.

20. An inductive device as recited in claim 18 , wherein said plurality of wire segments includes wire segments of different diameters.

21. An inductive device as recited in claim 18 , wherein said plurality of wire segments are embedded in a matrix.

22. An inductive device as recited in claim 21 , wherein said matrix includes magnetic particles.

23. An inductive device as recited in claim 1 , wherein said flux coupling structure includes a matrix containing magnetic particles.

24. An inductive device as recited in claim 1 , wherein said gap is formed at an end of said inductive device.

25. An inductive device as recited in claim 1 , wherein said plurality of wires include wires of different diameters arranged to increase the density of said magnetic core.

26. An inductive device as recited in claim 1 , wherein said plurality of wires substantially envelop said electric winding to provide shielding from electromagnetic fields.

27. An inductive device as recited in claim 1 , wherein said first and second end portions of said at least one wire are secured in place.

28. An inductive device as recited in claim 27 , wherein said first and second end portions are secured by said flux coupling structure.

29. An inductive device as recited in claim 1 , further comprising a second electric winding extending around said magnetic core and at least partially encircled by said one or more wires.

30. An inductive device as recited in claim 29 , wherein said second electric winding is axially displaced from said electric winding.

31. An inductive device as recited in claim 29 , wherein said second electric winding is arranged concentrically with said electric winding.

32. An inductive device as recited in claim 1 , wherein said electric winding is in direct contact with said magnetic core.

33. A method for making an inductive device, comprising:

providing a magnetic core including a portion of a plurality of wires;

arranging an electric winding around said magnetic core;

configuring one or more of said plurality of wires so as to at least partially encircle said electric winding and form a gap between first and second end portions of said one or more wires; and

providing a flux coupling structure in a vicinity of said gap so as to enhance coupling of magnetic flux between said first and second end portions.

34. A method as recited in claim 33 , wherein said flux coupling structure is disposed in said gap.

35. A method as recited in claim 33 , wherein said flux coupling structure is disposed adjacent said gap.

36. A method as recited in claim 33 , wherein said flux coupling structure spans a width of said gap.

37. A method as recited in claim 36 , wherein said flux coupling structure is disposed in said gap.

38. A method as recited in claim 37 , wherein said flux coupling structure is press fitted in said gap.

39. A method as recited in claim 36 , wherein said flux coupling structure is disposed adjacent to said gap.

40. A method as recited in claim 33 , wherein said flux coupling structure spans only part of a width of said gap.

Assignments (1)
RELEASE Recorded May 18, 2010
From: SILICON VALLEY BANK
To: T RAM SEMICONDUCTOR INCORPORATED
Reel/Frame 024492/0651 →