Substrate for an electric component and method for the production thereof
View Patent ↗For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.
1. A component comprising a substrate having a chip mounted thereon, said substrate comprising at least one layer of a non-warping ceramic, said at least one layer having feedthroughs provided therein; a first metallization being arranged over each of the feedthroughs as a large-surface connection pad; the substrate and the connection pads facing the chip being covered with a photostructured layer, the photostructured layer having openings, each opening uncovering a part of the respective connection pad; under-bump metallizations, each under-bump metallization being provided by the uncovered part of the respective connection pad; and solder bumps being arranged on said under-bump metallizations, each solder bump being arranged in the respective opening of the photostructured layer, said solder bumps being selected from galvanically-deposited and currentless-deposited materials.
2. A component according to claim 1 , wherein the separation between solder bumps is less than 75 μm.
3. A component according to claim 1 , wherein the non-warping ceramic is an LTCC ceramic.
4. A component according to claim 1 , wherein the non-warping ceramic is a ceramic having a low-warping during sintering, with a shrinkage after sintering being less than 0.1%.
5. A component according to claim 1 , wherein the chip is a surface acoustical wave component being soldered over the solder bumps using a flip-chip technique.
6. A component according to claim 5 , which includes a protective layer being selected from a single-layer and a multiple-layer film being laid over the acoustical wave component.
7. A component according to claim 5 , which includes a protective layer being deposited over the surface acoustical wave component to form a protective layer.