IP Library Granted Patent US 7,303,340
Granted Patent B2
US 7,303,340 · App. 10/471,964 · Granted Dec 4, 2007

Optoelectronic transmitter module and method for the production thereof

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Quick Facts
Patent No.
US 7,303,340
App. No.
10/471,964
Granted
Dec 4, 2007
Kind
B2
Abstract

The invention relates to an optoelectronic emission module comprising a housing (B), which has electrical terminal contacts ( 5 ) for supplying and/or carrying away electric signals or for supplying electrical power. Said emission module also has at least one optical emission element ( 13 ), which is arranged inside the housing ( 3 ), and has at least one optical waveguide ( 17 ), which is held inside or on the housing ( 3 ) and in whose injection end ( 19 ) the light emitted by the at least one optical emission element ( 13 ) can be injected. The at least one optical emission element ( 13 ) and the injection end ( 19 ) of the at least one optical waveguide ( 17 ) are mounted on a supporting element. The invention also relates to a method for producing an emission module of the aforementioned type.

Claims (29)

1. An optoelectronic transmitter module comprising:

a housing having electrical contacts for communicating electrically with the optoelectronic module and for supplying electrical power thereto;

an optical transmitter element positioned inside the housing, wherein the optical transmitter element comprises a semiconductor laser chip having integrated spot broadening using a taper structure; and

a contiguous optical waveguide positioned in the housing, the contiguous optical waveguide having a coupling end with a front surface into which light emitted by the optical transmitter element can be injected and a fiber grating for creating a fiber grating laser formed in the coupling end, wherein the optical transmitter and the coupling end of the contiguous optical waveguide are positioned on a supporting element such that the coupling end of the contiguous optical waveguide is configured to receive the light emitted by the optical transmitter from the optical transmitter.

2. The optoelectronic transmitter module of claim 1 , wherein the supporting element is formed from a heat-conducting metallic material.

3. The optoelectronic transmitter module of claim 2 , wherein the supporting element is connected to the housing so as to dissipate heat from the optical transmitter element.

4. The optoelectronic transmitter module of claim 2 , wherein the supporting element is connected to a cooling element so as to dissipate heat from the optical transmitter element.

5. The optoelectronic transmitter module of claim 1 , wherein the optical transmitter element is positioned on a substrate, by which the optical transmitter element is positioned on the supporting element.

6. The optoelectronic transmitter module of claim 1 , wherein:

the coupling end is positioned in a fastening element;

the supporting element defines a first stopping face that cooperates with a second stopping face on the fastening element to define the position of the coupling end of the contiguous optical waveguide in the axial direction.

7. The optoelectronic transmitter module of claim 6 , wherein the fastening element comprises a ferrule that holds the coupling end.

8. The optoelectronic transmitter module of claim 7 , wherein:

the fastening element includes a receptacle part that defines the second stopping face; and

the ferrule is held in a drill hole in the receptacle part.

9. The optoelectronic transmitter module of claim 8 , wherein the ferrule is press-fitted in the drill hole.

10. The optoelectronic transmitter module of claim 6 , wherein a V-groove is formed in the fastening element to receive the coupling end.

11. The optoelectronic transmitter module of claim 1 , wherein a V-groove is formed in the supporting element to receive the coupling end.

12. The optoelectronic transmitter module of claim 1 , wherein a space between an emitting surface of the optical transmitting element and a front surface of the coupling end is filled with a transparent material.

13. The optoelectronic transmitter module of claim 12 , wherein the transparent material is a transparent sealing compound.

14. The optoelectronic transmitter module of claim 1 , wherein the housing is not hermetically sealed.

15. The optoelectronic transmitter module of claim 1 , wherein the optical transmitter and the coupling end of the contiguous optical waveguide are positioned on a common supporting element.

16. The optoelectronic transmitter module of claim 1 , wherein the optical transmitter element includes a plurality of light-emitting surfaces, the optoelectronic transmitter module further comprising:

at least one additional contiguous optical waveguide positioned in the housing, each of the contiguous optical waveguides having a coupling end with a front surface into which light can be injected, wherein the optical transmitter element and the coupling ends of the contiguous optical waveguides are positioned on a supporting element so that each of the plurality of front surfaces resides directly in front of a respective light-emitting surface of the optical transmitter.

17. The optoelectronic transmitter module as recited in claim 16 , further comprising a fastening plate disposed over the coupling ends and attached to the supporting element.

18. The optoelectronic transmitter module as recited in claim 17 , wherein the supporting element defines a plurality of grooves, each of which receives a portion of a respective contiguous optical waveguide.

19. The optoelectronic transmitter module as recited in claim 16 , further comprising:

a positioning and fastening element upon which the plurality of coupling ends are at least partially disposed; and

a fastening plate disposed over the plurality of coupling ends and attached to the supporting element.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →