Method for producing a contactless chip card and chip card produced according to said method
View Patent ↗The invention relates to a method for producing a transponder, especially a contactless chip card ( 1 ) comprising at least one electronic component (chip module 2 ) and at least one antenna ( 3 ); the at least one electronic chip component ( 2 ) being disposed on a non-conducting substrate that serves as a support for the component. The at least one antenna is also disposed on a non-conducting substrate, the at least one electronic component ( 2 ) being applied to a first substrate and the antenna ( 3 ) on a second substrate. The entire circuit ( 1 ) is then produced by joining the individual substrates so that they are correctly positioned relative to each other. The components ( 2, 3 ) are contacted once the different substrates have been joint by means of auxiliary materials such as solder or glue, or without auxiliary materials by microwelding. The non-conducting substrates form a base card body.
1. A method for producing a transponder or contactless chip card, said transponder or contactless chip card comprises a first non-conductive substrate and a second non-conductive substrate, an electronic component and an antenna, said first and said second non-conductive substrates having essentially the same outer boundaries, said method comprises the steps of:
arranging said electronic component on said first non-conductive substrate serving as a component support;
arranging said antenna on said second non-conductive substrate;
laminating the first substrate in direct contact with the second substrate using heat, thereby melting the first and second substrates so that said electronic component is countersunk into the substrates and a hermetically sealed connection is provided between said electronic component and said antenna, wherein said laminated non-conductive substrates forms a base card body, the thickness of the base card body being substantially equal to a sum of the thickness of the first substrate and the thickness of the second substrate.
2. The method according to claim 1 , wherein said transponder or contactless chip card comprises multiple electronic components and multiple antennae.
3. The method according to claim 1 , comprising the further step of contacting said electronic component arranged on said first substrate to said antenna arranged on said second substrate.
4. The method according to claim 3 , wherein said step of contacting includes applying an auxiliary material between said electronic component and said antenna.
5. The method according to claim 3 , wherein said step of contacting includes micro-welding said electronic component arranged on said first substrate to said antenna arranged on said second substrate without auxiliary materials.
6. The method according to claim 4 wherein the auxiliary materials includes a solder material or an adhesive.
7. A transponder unit or a chip card, comprising a first non-conductive substrate and a second non-conductive substrate, an electronic component and an antenna, said first and said second non-conductive substrates having essentially the same outer boundaries, whereby said electronic component is arranged on said first non-conductive substrate serving as a component support, and said antenna also is arranged on said second non-conductive substrate, wherein said transponder unit or said chip card is produced by laminating the first substrate in direct contact with the second substrate using heat, thereby melting the first and second substrates so that said electronic component is countersunk into the substrates and a hermetically sealed connection is provided between said electronic component and said antenna, the thickness of the transponder unit or the chip card being substantially equal to a sum of the thickness of the first substrate and the thickness of the second substrate.
8. The transponder unit according to claim 7 , further comprising top layers, which are applied after the assembly of the substrate layers on the top or bottom side.
9. The transponder unit according to claim 8 , wherein the transponder unit is integrated in a further housing.