Copper plating solution and method for copper plating
View Patent ↗A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.
1. A copper plating solution comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sodium sulfite and/or potassium sulfite, and has a pH adjusted to 5.0 to 8.5 and is free from formaldehyde, said solution does not produce gaseous hydrogen.
2. A method for copper plating an article to be plated, comprising using the copper plating solution as claimed in claim 1 .
3. A method for copper plating as claimed in claim 2 , wherein the copper plating method is electroless plating method.
4. A method for copper plating as claimed in claim 3 , wherein the article to be plated is a rare earth metal-based permanent magnet.
5. A method for copper plating as claimed in claim 4 , wherein the rare earth metal-based permanent magnet is a bonded magnet.
6. A method for copper plating as claimed in claim 5 , wherein the bonded magnet is ring-shaped.
7. A method for copper plating as claimed in claim 2 , wherein the article to be plated is a rare earth metal-based permanent magnet.
8. A method for copper plating as claimed in claim 7 , wherein the rare earth metal-based permanent magnet is a bonded magnet.
9. A method for copper plating as claimed in claim 8 , wherein the bonded magnet is ring-shaped.