Throughplating of flexible printed boards
View Patent ↗For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.
1. A substrate for a card with an integrated circuit, the substrate being coated on two opposing top and bottom surfaces, each surface having an electrically conductive material layer thereon, and each of the electrically conductive layers being electrically interconnected through the substrate, characterized by a cut-shaped passage going through at least one of the substrate or the two electrically conductive layers, wherein the cut-shaped passage extends obliquely to the surfaces, and tabs are produced by the cut-shaped passage, which tabs are urged past each other so that the conductive layer on the top surface of the substrate touches the conductive layer on the bottom surface of the substrate.
2. A card with an integrated circuit comprising a substrate according to claim 1 .
3. A card according to claim 2 , characterized in that the substrate forms a layer of a body of the card.
4. A method for producing a substrate according to claim 1 , comprising the steps of:
providing a substrate with separate electrically conductive layers on opposing top and bottom surfaces of the substrate,
cutting through at least one of the substrate or the electrically conductive layers by means of a cutting tool so that a cut-shaped passage remains after removal of the tool, wherein the cut-shaped passage extends obliquely to the surfaces, and tabs are produced by the cut-shaped passage, which tabs are urged past each other so that the conductive layer on the top surface of the substrate touches the conductive layer on the bottom surface of the substrate.