IP Library › Granted Patent US 7,301,779
Granted Patent B2
US 7,301,779 · App. 10/479,735 · Granted Nov 27, 2007

Electronic chip and electronic chip assembly

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Quick Facts
Patent No.
US 7,301,779
App. No.
10/479,735
Granted
Nov 27, 2007
Kind
B2
Abstract

A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip.

Claims (14)

1. An electronic chip assembly comprising:

a first electronic chip;

a second electronic chip;

the first electronic chip having a plurality of external chip contacts to which a multiplicity of nanotubes are applied in order to make contact between the first electronic chip and the second electronic chip;

the second electronic chip having a plurality of external chip contacts that are free of nanotubes and that can be brought into contact with the nanotubes that have been applied to the external chip contacts of the first electronic chip; and

wherein the nanotubes of one external chip contact of the first electronic chip are brought into contact with one external chip contact of the second electronic chip.

2. The electronic chip assembly according to claim 1 , wherein the multiplicity of nanotubes are a multiplicity of carbon nanotubes.

3. The electronic chip assembly according to claim 1 , wherein the external chip contact of the first electronic chip has a chip contact layer and a catalyst layer applied thereto and wherein the material of the catalyst layer has a catalytic action with regard to the growth of the nanotubes.

4. The electronic chip assembly according to claim 1 ,wherein the external chip contacts of the first electronic chip and the chip contact of the second electronic chip includes at least one metal from the group aluminum and copper.

5. The electronic chip assembly according to claim 3 , wherein the catalyst layer includes at least one metal from the group nickel, cobalt, and iron.

6. The electronic chip assembly according to claim 1 , wherein the nanotubes are soldered to the external chip contacts of the first electronic chip or to the chip contact of the second electronic chip.

7. The electronic chip assembly according to claim 1 , wherein the nanotubes are electrochemically coupled to the external chip contacts of the first electronic chip or to the chip contact of the second electronic chip.

8. The electronic chip assembly according to claim 1 , wherein the first electronic chip is designed as a test chip.

9. The electronic chip assembly according to claim 8 , wherein the test chip has an integrated test circuit.