IP Library Granted Patent US 7,312,470
Granted Patent B2
US 7,312,470 · App. 10/481,236 · Granted Dec 25, 2007

Thin film transistor array panel and method for fabricating the same

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Quick Facts
Patent No.
US 7,312,470
App. No.
10/481,236
Granted
Dec 25, 2007
Kind
B2
Abstract

The present invention relates to a TFT array panel and a fabricating method thereof. A gate insulating layer and a passivation layer are formed by printing organic insulating material in order to simplify the fabricating process. The inventive TFT panel includes an insulating substrate, and a gate wire formed on the insulating substrate. The gate wire includes a gate line and a gate pad connected to one end of the gate line. A gate insulating layer is formed on the insulating substrate while exposing the gate pad and a portion of the gate line close to the gate pad. A semiconductor pattern is formed on the gate insulating layer. A data wire is formed on the gate insulating layer. The data wire includes a data line, a source electrode connected to the data line, a drain electrode facing the source electrode and a data pad connected to one end of the data line. A passivation layer is formed on the gate insulating layer while exposing the data pad and a portion of the data line close to the data pad.

Claims (19)

1. A thin film transistor array panel comprising:

an insulating substrate;

a gate wire formed on the insulating substrate and including a gate line, and a gate pad connected to one end of the gate line;

a gate insulating layer formed on the insulating substrate while exposing the gate pad and a portion of the gate line close to the gate pad;

a semiconductor pattern formed on the gate insulating layer;

a data wire formed on the gate insulating layer and including a data line intersecting the gate line, a source electrode projecting from the data line and contacting the semiconductor pattern, a drain electrode facing the source electrodes and contacting the semiconductor pattern, and a data pad connected to one end of the data line; and

a passivation layer formed on the gate insulating layer while exposing the data pad and a portion-of the data line close to the data pad, wherein the passivation layer further exposes a portion of the gate insulating layer formed close to the gate pad, and wherein the passivation layer comprises organic material.

2. The thin film transistor array panel of claim 1 further comprising a common wire formed on the substrate and including a common electrode line parallel to the gate line, a common electrode connected to the common electrode line, and a common electrode pad connected to one end of the common electrode line, the gate insulating layer exposing the common electrode pad, and a portion of the common electrode line close to the common electrode pad.

3. The thin film transistor array panel of claim 1 or 2 wherein at least one of the gate insulating layer and the passivation layer is made of an organic insulating material.

4. The thin film transistor array panel of claim 1 wherein the semiconductor pattern having a thin portion disposed between the source electrode and the drain electrode, the thin portion being thinner than a portion of the semiconductor pattern contacting the source electrode and the drain electrode.

5. The thin film transistor array panel of claim 1 further comprising a pixel electrode line disposed substantially parallel to the gate line and connected to the drain electrode formed on the substrate, wherein the drain electrode is a projection from the pixel electrode line and is disposed substantially parallel to the gate line.

6. A thin film transistor array panel comprising:

an insulating substrate;

a gate wire formed on the insulating substrate and including a gate line, and a gate pad connected to one end of the gate line; a gate insulating layer formed on the insulating substrate while exposing the gate pad and a portion of the gate line close to the gate pad;

a semiconductor pattern formed on the gate insulating layer;

a data wire formed on the gate insulating layer and including a data line intersecting the gate line, a source electrode connected to the data line and contacting the semiconductor pattern, a drain electrode facing the source electrodes and contacting the semiconductor pattern, and a data pad connected to one end of the data line;

a common wire formed on the substrate and including a common electrode line parallel to the gate line, a common electrode connected to the common electrode line, and a common electrode pad connected to one end of the common electrode line, the gate insulating layer exposing the common electrode pad, and a portion of the common electrode line close to the common electrode pad; and

a passivation layer formed on the gate insulating layer while exposing the data pad and a portion of the data line close to the data pad wherein the passivation layer further exposes a portion of the gate insulating layer and an end portion of the common electrode line close to the gate pad.

7. The thin film transistor array panel of claim 6 further comprising a pixel electrode line disposed substantially parallel to the gate line and connected to the drain electrode formed on the substrate, wherein the drain electrode is a projection from the pixel electrode line and is disposed substantially parallel to the gate line.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2004
From: BYUN, JAE-SEONG; LEE, KUN-JONG; LIM, HYUN-SU; CHA, JONG-HWAN; JUNG, BAE-HYOUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015850/0651 →