Curable epoxy resin composition
View Patent ↗A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
1. A curable epoxy resin composition comprising:
(A) a crystalline epoxy resin,
(B) a phenol resin,
(C) a silicone resin, and,
(D) an inorganic filler added in an amount of 400 to 1,200 parts by weight for each 100 parts by weight of the total weight of components (A) through (C), said silicone resin represented by the following average unit formula:
(R 1 SiO 3/2 ) a (R 2 R 3 SiO 2/2 ) b (R 4 R 5 R 6 SiO 1/2 ) c (SiO 4/2 ) d, (XO 1/2 ) e
wherein R 1 , R 2, R 3, R 4, R 5, and R 6 may be the same or different monovalent hydrocarbon groups or epoxy-containing organic groups, of which said epoxy-containing organic groups constitute 0.1 to 40 mole % of the total amount of R 1 through R 6 contained in the molecule, and 10 or more mole % are phenyl groups; X is a hydrogen atom or an alkyl group; a is a positive number; b is 0 or a positive number; c is 0 or a positive number; d is 0 or a positive number, e is 0 or a positive number; b/a is a number between 0 and 10; c/a is a number between 0 and 0.5; d/a+b+c+d is a number between 0 and 0.3; and e/(a+b+c+d) is a number between 0 and 0.4, component (C) being used in an amount of 0.1 to 500 parts by weight for each 100 parts by weight of the sum of components (A) and (B).
2. The curable epoxy resin composition of claim 1 , wherein said component (A) is a biphenyl type epoxy resin.
3. The curable epoxy resin composition of claim 1 , wherein said component (B) is a phenolaralkyl type phenol resin.
4. The curable epoxy resin composition of claim 1 , wherein said component (C) has a softening point within the range of 25° C. to 150° C.
5. The curable epoxy resin composition of claim 1 , wherein, after holding for 20 minutes at a temperature of 160° C., said component (C) has a coefficient of variation of melt viscosity not exceeding 10%.
6. The curable epoxy resin composition of claim 1 , wherein said component (C) has a weight-average molecular weight within the range of 500 to 50,000.
7. The curable epoxy resin composition of claim 1 , wherein said component (C) is a silicone resin prepared by causing a reaction between:
(I) a siloxane or silane of one type or a mixture of different types of siloxanes or silanes providing at least one type of the units selected from the group consisting of:
(i) units of the formula R 7 SiO 3/2, wherein R 7 is a monovalent hydrocarbon group;
(ii) units of the formula R 8 R 9 SiO 2/2 , wherein R 8 and R 9 are either the same or different monovalent hydrocarbon groups;
(iii) units of the formula R 10 R 11 R 12 SiO 1/2 , wherein R 10 , R 11 , and R 12 are either the same or different monovalent hydrocarbon groups; and
(iv) units of the formula SiO 4/2 and,
(II) an epoxy-containing alkoxysilane having the general formula, or a product of partial hydrolysis of the aforementioned alkoxysilane: R 13 R 14 f Si(OR 15 ) (3-f) wherein R 13 is an epoxy-containing organic group, R 14 is a monovalent hydrocarbon group, R 15 is an alkyl group, and ƒ is 0, 1, or 2.