IP Library Granted Patent US 7,119,142
Granted Patent B2
US 7,119,142 · App. 10/484,330 · Granted Oct 10, 2006

Preparation of a conductive liquid silicone rubber composition

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Quick Facts
Patent No.
US 7,119,142
App. No.
10/484,330
Granted
Oct 10, 2006
Kind
B2
Abstract

A method for producing a conductive liquid silicone rubber composition having an excellent storage stability and suitable for molding a conductive silicone rubber article with an arbitrary speed of curing and with good reproducibility of arbitrarily selected hardness and volume resistivity. The method comprises mixing component (A) which is a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule, component (B) which is a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule and a volume resistivity different from that of (A), component (C) a platinum-based catalyst; and component (D) which is a cross-linker that comprises an organopolysiloxane having two or more silicon-bonded hydrogen atoms in one molecule.

Claims (25)

1. A method of manufacturing a conductive liquid silicone rubber composition comprising mixing the following components:

(A) a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule;

(B) a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule and a volume resistivity different from that of (A);

(C) a catalytic agent that comprises a platinum-based catalyst; and

(D) a cross-linker that comprises an organopolysiloxane having two or more silicon-bonded hydrogen atoms in one molecule; wherein the volume resistivities of components (A) and (B) are in accordance with the following relationship 10≦R a /R b ≦100000, and wherein 10 3 Ohm·cm≦R a ≦10 13 Ohm·cm; 10 2 Ohm·cm ≦R b ≦10 12 Ohm·cm wherein R a is the volume resistivity of a formed article obtained by mixing component (A) with the components (C) and (D) with subsequent thermal curing of the mixture, and wherein R b is the volume resistivity of a formed article obtained by the same method from component (B).

2. The method in accordance with claim 1 wherein the conductive fillers of components (A) and (B) both comprise the same or different non-metallic conductive filler having a volume resistivity below 10 3 Ohm·cm.

3. The method in accordance with claim 2 , wherein said conductive filler of a non-metal type is carbon black in an amount from 1 to 30 wt. %.

4. The method in accordance with claim 1 , wherein volume resistivity of a cured body of said conductive liquid silicone rubber composition is within the range from 10 6 Ohm·cm to 10 12 Ohm·cm.

5. The method in accordance with claim 1 , wherein the sum of amounts of components (C) and (D) is from 1 to 20 parts by weight for each 100 parts by weight of the sum of amounts of components (A) and (B).

6. The method in accordance with claim 1 wherein the method of mixing is a continuous process.

7. The method in accordance with claim 6 comprising continuously feeding metered amounts of each of components (A), (B), (C), and (D) to a mixing apparatus and mixing the composition to uniformity.

8. A method of manufacturing articles having a predetermined resistivity range by varying the amounts of components (A) and (B) entering into the mixing apparatus in the method of claim 7 and curing the mixture upon removal from said apparatus.

9. The method in accordance with claim 2 , wherein the sum of amounts of components (C) and (D) is from 1 to 20 parts by weight for each 100 parts by weight of the sum of amounts of components (A) and (B).

10. The method in accordance with claim 2 , wherein the sum of amounts of components (C) and (D) is from 1 to 20 parts by weight for each 100 parts by weight of the sum of amounts of components (A) and (B).

11. The method in accordance with claim 2 wherein the method of mixing is a continuous process.

12. The method in accordance with claim 3 wherein the method of mixing is a continuous process.

13. The method in accordance with claim 11 comprising continuously feeding metered amounts of each of components (A), (B), (C), and (D) to a mixing apparatus and mixing the composition to uniformity.

14. The method in accordance with claim 12 comprising continuously feeding metered amounts of each of components (A), (B), (C), and (D) to a mixing apparatus and mixing the composition to uniformity.

15. An article formed from the conductive liquid rubber composition obtained by the method as claimed in claim 8 .

16. A method of manufacturing articles having a predetermined resistivity range by varying the ratios of components (A), (B), (C), and (D) entering into the mixing apparatus in the method of claim 7 .

17. A four-part kit adapted to be used in the method according to claim 1 wherein:

component (A) is a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule;

component (B) is a mixture of a conductive filler with a liquid diorganopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule and a volume resistivity different from that of(A);

component (C) is a catalytic agent that comprises a platinum-based catalyst; and

component (D) is a cross-linker that comprises an organopolysiloxane having two or more silicon-bonded hydrogen atoms in one molecule; wherein the volume resistivities of components (A) and (B) are in accordance with the following relationship 10≦R a /R b ≦100000, and wherein 10 3 Ohm·cm≦R a ≦10 13 Ohm·cm; 10 2 Ohm·cm ≦R b ≦10 12 Ohm·cm wherein R a is the volume resistivity of a formed article obtained by mixing component (A) with the components (C) and (D) with subsequent thermal curing of the mixture, and wherein R b is the volume resistivity of a formed article obtained by the same method from component (B).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2004
From: HIGUCHI, KAZUO; KURUSU, HIDETOSHI; NAKAMURA, AKITO
To: DOW CORNING TORAY SILICONE CO., LTD.
Reel/Frame 015110/0321 →