Oscillator with a guard ring formed around an N well and constituent components integrally formed on the N well, on a semiconductor substrate
View Patent ↗An oscillator capable of reducing a noise component when partly formed by using the CMOS process or the MOS process. A high-frequency amplifier circuit, a mixing circuit, a local oscillator 13 , intermediate-frequency filters, an intermediate-frequency amplifier circuit, a limit circuit, an FM detection circuit, and a stereo demodulation circuit which constitute an FM receiver are formed as a one-chip component. The local oscillator 13 is formed on a semiconductor substrate by using the CMOS process or the MOS process and the transistors constituting the circuit are p-channel type FETs 21, 22 . Moreover, the local oscillator 13 has a resonance circuit whose one end is connected to a DC bias circuit composed of a resistor 27 and the center voltage of the oscillation is set to a value higher than 0 V.
1. An oscillator in which constituent components including a transistor as amplifier element are integrally formed on a semiconductor substrate using a CMOS process or a MOS process,
wherein said transistor is formed using a p-channel type FET,
wherein an N well is formed in said semiconductor substrate, and said constituent components are formed on the N well, and
wherein a guard ring is formed outside of and around said N well so as to extend from a surface of said semiconductor substrate down to a position deeper than said N well, said guard ring being formed separately from said N well.
2. The oscillator according to claim 1 , having a resonance circuit having one end grounded in an AC manner and a DC bias circuit that provides this end with a DC bias voltage.
3. The oscillator according to claim 1 , wherein said guard ring is formed outside of said N well.
4. The oscillator according to claim 1 , wherein said semiconductor substrate is a P type semiconductor substrate and said guard ring is formed as an N type region in said semiconductor substrate, wherein the combination of said guard ring and semiconductor substrate forms a PNP layer.