IP Library Granted Patent US 7,144,953
Granted Patent B2
US 7,144,953 · App. 10/492,848 · Granted Dec 5, 2006

Curable resin composition

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,144,953
App. No.
10/492,848
Granted
Dec 5, 2006
Kind
B2
Abstract

The present invention provides a composition, which is easy to produce because of high ease of handling the starting materials. The composition exhibits excellent transparency, and a product prepared using the composition exhibits excellent mechanical properties and adhesive properties. The curable resin composition contains (A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds; (B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C 1 –C 2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having C 7 –C 9 alkyl; and (C) a curing agent.

Claims (8)

1. A curable resin composition comprising:

(A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds;

(B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C 1 –C 2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having -alkyl selected from the group consisting of 2-ethylhexyl, isooctyl and isononyl; and

(C) a curing agent.

2. The curable resin composition according to claim 1 , wherein the molecular chain of the polymer (A) consists substantially of a repeating unit represented by general formula (1):

—CH(CH 3 )CH 2 —O—  (1)

3. The curable resin composition according to claim 1 or 2 , wherein the number-average molecular weight of the polymer (A) is at least 6,000 and Mw/Mn is 1.6 or less.

4. The curable resin composition according to one of claims 1 to 3 , wherein the main chain of the polymer of (A) is synthesized by polymerizing alkylene oxide in the presence of an initiator and at least one catalyst selected from the group consisting of a cyanide complex of compound metal, a cesium compound, and a compound containing a P═N bond.

Assignments (2)
CHANGE OF ADDRESS Recorded Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2004
From: UEDA, KAZUHIKO; KOTANI, JUN; KOMITSU, SHINTARO; IWAKIRI, HIROSHI
To: KANEKA CORPORATION
Reel/Frame 015774/0040 →