Method of fixing a sealing object to a base object
View Patent ↗A sealing-object ( 4 ) is fixed to a base-object ( 10 ). The sealing-object comprises a through-hole ( 5 ). The objects are fixed to each other in the following manner. In a preparation step, a fixing layer ( 1, 2, 3 ) is provided between the base-object and the sealing-object. In addition an evacuation device ( 6 ) equipped with an evacuation channel ( 7 ) is placed onto the sealing-object. The through-hole of the sealing object has a first extremity opening out on the evacuation channel and a second extremity opening out on the fixing layer. In a fixing step, the fixing layer is heated which causes the fixing layer to release gas. The gas is at least partially evacuated via the through-hole of the sealing-object and the evacuation channel of the evacuation device.
1. An assembly comprising a first silicon slice and a second silicon slice fixed to each other, each silicon slice having an inner main face and an outer main face, the first silicon slice and the second silicon slice being fixed by means of a fixing layer produced through heating and having redundant products released during the heating and provided between the inner main faces of the silicon slices, the second silicon slice comprising a through-hole having a first extremity opening out on the inner main face and a second extremity opening out on the outer main face wherein said through-hole is designed to enable the evacuation of the redundant products.
2. A method of fixing a sealing-object to a base-object, wherein the sealing-object comprises a through-hole, the method comprising:
a preparation step, in which a fixing layer is provided between the base-object and the sealing-object, and in which an evacuation device equipped with an evacuation channel is placed onto the sealing-object, the through-hole of the sealing object having a first extremity opening out on the evacuation channel and a second extremity opening out on the fixing layer;
a fixing step, in which the fixing layer is heated which causes the fixing layer to release gas, the gas being at least partially evacuated via the through-hole of the sealing-object and the evacuation channel of the evacuation device.
3. The method according to claim 2 , wherein the base-object is a substrate comprising integrated circuits.
4. The method according to claim 1 , wherein the sealing-object is a substrate of the same type as the base-object.
5. The method according to claim 2 , wherein in the fixing step, the fixing layer is heated by varying the temperature according to cycles so as to obtain a thermal pumping effect.
6. The method according to claim 2 , wherein in the preparation step, an auxiliary layer is provided between the base-object and the fixing layer, the auxiliary layer comprising an adhesion agent and an impermeability agent.
7. The method according to claim 2 , wherein in the preparation step, an auxiliary layer is provided between the sealing-object and the fixing layer, the auxiliary layer comprising an adhesion agent and an impermeability agent.
8. A method of sealing a base object, the method comprising:
a preparation step, in which an assembly is formed that comprises, in successive order, the base object, a fixing layer, a sealing object and a gas-evacuation object, the sealing object being provided with a through-hole and the gas-evacuation object being provided with a gas-evacuation channel, the assembly being formed so that the through hole constitutes a passage extending from the fixing layer to the gas-evacuation channel;
a fixing step, in which the assembly is heated which causes the fixing layer to release a gas, the gas being at least partially evacuated via the through hole of the sealing object and the gas-evacuation channel of the gas-evacuation object.