Chip scale package for a transponder
The invention relates to a transponder device which comprises a chip ( 5 ) and an antenna ( 8 ), the chip ( 5 ) being connected to the antenna ( 8 ), the transponder is characterized by the fact that the chip ( 5 ) is packed with a protective and insulating layer ( 14 ) of at least 30 μm thick, the layer being at least arranged between the chip ( 5 ) and the antenna ( 8 ), the antenna ( 8 ) being connected to the chip ( 5 ) through said layer ( 14 ).
1 . Transponder device comprising a chip ( 5 ) and an antenna ( 8 ), the chip ( 5 ) being connected to the antenna ( 8 ), characterized by the fact that the chip ( 5 ) is packed with a protective and insulating layer ( 14 ) of at least 30 μm thick, said layer being at least arranged between the chip ( 5 ) and the antenna ( 8 ), the antenna ( 8 ) being connected to the chip ( 5 ) through said layer ( 14 ).
2 . Transponder device according to claim 1 wherein connecting means ( 15 ) are connecting the chip ( 5 ) to the antenna ( 8 ), said connecting means ( 15 ) being arranged in said layer ( 14 ) and being enlarged on the package surface or antenna side of said layer ( 14 ) in order to facilitate the connection between the antenna ( 8 ) and the connecting means ( 15 ).
3 . Transponder device according to claim 2 wherein said connecting means ( 15 ) are enlarged on the package surface or on the antenna side of said layer ( 14 ) in such a way that they constitute the antenna.
4 . Transponder device according to claim 3 wherein said connecting means ( 15 ) are enlarged on the package surface or on the antenna side of said layer ( 14 ) in such a way that they constitute a surface for mounting additional electronics such as capacitor or chips.
5 . Transponder device according to claim 1 wherein said layer ( 14 ) is made of organic material such as epoxy.
6 . Transponder device according to claim 1 wherein the chip is packed by a plurality of protective and insulating layers arranged at least between the chip ( 5 ) and the antenna ( 8 ), the antenna ( 8 ) being connected to the chip ( 5 ) through said layers ( 14 ) by a plurality of connecting means ( 15 ).