IP Library Granted Patent US 7,025,857
Granted Patent B2
US 7,025,857 · App. 10/498,222 · Granted Apr 11, 2006

Plasma treatment apparatus, matching box, impedance matching device, and coupler

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Quick Facts
Patent No.
US 7,025,857
App. No.
10/498,222
Granted
Apr 11, 2006
Kind
B2
Abstract

A matching box is provided with a contact device insertion section serving as a slot into which a contact device is inserted. When the matching box is fixed on the outer wall of the side surface of a vacuum container, the matching box is positioned so as to be in a state where a space margin is provided between itself and a power feeding bar. Thereafter, electric contact between the external circuit and the power feeding bar is established by inserting a contact device into the contact device insertion section. A socket 40 provided at the output portion of an impedance matching device has, at the center portion of a metal body 40 a formed into a cylindrical structure, an insertion hole 41 for inserting a power feeding bar 32 thereinto to support it A cover layer 42 made of an insulation material is provided on the inner wall of the insertion hole 41 , thereby electrically insulating the insertion hole 41 from the power feeding bar 32 . A high frequency electricity generated by a second high frequency power source 51 is conducted to the power feeding bar 32 by inductive coupling.

Claims (28)

1. A plasma treatment apparatus comprising:

a vacuum container ( 2 ) in which a process target is processed with use of a gas turned into plasma;

plasma generation electrodes ( 8 , 5 ) which are arranged in said vacuum container;

high frequency power sources ( 50 , 51 ) which generate a high frequency electricity to be supplied to said plasma generation electrodes;

power feeding bars ( 19 , 32 ) which conduct a high frequency electricity generated by said high frequency power sources to said plasma generation electrodes;

matching boxes ( 20 , 34 ) which include matching circuits ( 21 a , 34 a ) for matching input impedances to said plasma generation electrodes and output impedances of said high frequency power sources; and

contact devices ( 23 , 40 ) which establish electric contact between output terminals of said matching circuits ( 21 a , 34 a ) for outputting a high frequency electricity and input terminals of said power feeding bars for inputting the high frequency electricity,

wherein said contact devices are structured such that they can establish electric contact between said matching circuits and said power feeding bars after positioning of said power feeding bars ( 19 , 32 ) and said matching boxes ( 20 , 34 ) is completed.

2. The plasma treatment apparatus according to claim 1 , wherein

positioning of said power feeding bar ( 19 ) and said matching box ( 20 ) is completed by attaching said matching box ( 20 ) onto an outer wall of said vacuum container ( 2 ).

3. The plasma treatment apparatus according to claim 1 , wherein:

said matching box ( 20 ) comprises a slot ( 22 ) into which said contact device ( 23 ) can be inserted; and

electric contact between said matching circuits ( 21 a , 34 a ) and said power feeding bars is established by inserting said contact device ( 23 ) into said slot ( 22 ) in a state where said matching box ( 20 ) is attached to the outer wall of said vacuum container ( 2 ).

4. The plasma treatment apparatus according to claim 1 , comprising a heater ( 11 ) which heats the process target to be processed in said vacuum container ( 2 ),

wherein said contact device ( 23 ) is structured such that it can establish electric contact for supplying said heater with electricity supplied from a commercial power source.

5. The plasma treatment apparatus according to claim 4 ,

wherein said matching box comprises a coupler ( 40 ) which inserts thereinto said power feeding bar ( 32 ) connected to said plasma generation electrode in order to fix and support said power feeding bar ( 32 ) to and by said impedance matching device ( 34 ), and said coupler ( 40 ) comprises a cover layer ( 42 ) made of an insulation material at an insertion portion ( 41 ) of said power feeding bar ( 32 ).

6. The plasma treatment apparatus according to claim 5 , wherein

said coupler ( 40 ) is capable of supplying a high frequency electricity generated by said high frequency power source to said plasma generation electrode ( 5 ) by inductive coupling with said power feeding bar ( 32 ).

7. A plasma treatment apparatus comprising:

a vacuum container ( 2 ) in which a process target is processed with use of a gas turned into plasma;

a plasma generation electrode ( 5 ) which is arranged in said vacuum container;

a high frequency power source ( 51 ) which generates a high frequency electricity to be supplied to said plasma generation electrode;

an impedance matching device ( 34 ) which is connected between said plasma generation electrode and said high frequency power source in order to match an impedance to said plasma generation electrode and an output impedance of said high frequency power source; and

a coupler ( 40 ) which inserts thereinto a power feeding bar ( 32 ) connected to said plasma generation electrode to fix and support said power feeding bar ( 32 ) to and by said impedance matching device ( 34 ),

wherein said coupler ( 40 ) comprises a cover layer ( 42 ) made of an insulation material at an insertion portion ( 41 ) of said power feeding bar ( 32 ).

8. The plasma treatment apparatus according to claim 7 , wherein

said coupler ( 40 ) is capable of supplying a high frequency electricity generated by said high frequency power source to said plasma generation electrode ( 5 ) by inductive coupling with said power feeding bar ( 32 ).

Assignments (4)
SECURITY AGREEMENT Recorded Jun 15, 2006
From: FERRO CORPORATION
To: J.P. MORGAN TRUST COMPANY, NATIONAL ASSOCIATION, AS TRUSTEE
Reel/Frame 017794/0411 →
SECURITY AGREEMENT Recorded Jun 7, 2006
From: FERRO CORPORATION
To: NATIONAL CITY BANK, AS COLLATERAL AGENT
Reel/Frame 017730/0594 →
SECURITY AGREEMENT Recorded Apr 27, 2006
From: FERRO CORPORATION
To: NATIONAL CITY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 017527/0909 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2004
From: HIGASHIURA, TSUTOMU
To: TOKYO ELECTRON LIMITED
Reel/Frame 015802/0296 →