IP Library Granted Patent US 7,259,397
Granted Patent B2
US 7,259,397 · App. 10/498,669 · Granted Aug 21, 2007

Self-scanning light-emitting element array chip

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,259,397
App. No.
10/498,669
Granted
Aug 21, 2007
Kind
B2
Abstract

Provided is a self-scanning light-emitting element array chip structured on a substrate using Si. A lattice mismatching buffer layer ( 32 ) is formed on a Si substrate ( 30 ). On the lattice mismatching buffer layer ( 32 ), successively stacked are an n-type AlGaAs layer ( 14 ), a p-type AlGaAs layer ( 16 ), an n-type AlGaAs layer ( 18 ), and a p-type AlGaAs layer ( 20 ) in this order. On the AlGaAs layer ( 20 ) provided is an anode electrode ( 22 ), on the AlGaAs layer ( 18 ) a gate electrode ( 24 ), on the bottom surface of the GaAs substrate a cathode electrode ( 26 ).

Claims (19)

1. A self-scanning light-emitting element array chip, comprising:

a Si substrate;

a lattice mismatching buffer layer formed directly on the Si substrate, the buffer layer including a strained-layer super lattice; and

a self-scanning light-emitting element array including pnpn layers formed on the lattice mismatching buffer layer.

2. The self-scanning light-emitting element array chip according to claim 1 , further comprising:

a driver circuit formed an the Si substrate.

3. The self-scanning light-emitting element array chip according to claim 1 or 2 , wherein the width of the chip is in a range of 0.03 mm-0.3 mm.

4. The self-scanning light-emitting element array chip according to claim 3 , wherein the width of the chip is in a range of 0.05 mm-0.2 mm.

5. The self-scanning light-emitting element array chip according to claim 3 , wherein the length of the chip is in a range of 2 mm-100 mm.

6. The self-scanning light-emitting element array chip according to claim 5 , wherein the length of the chip is in a range of 5 mm-20 mm.

7. The self-scanning light-emitting element array chip according to claim 5 , wherein the height of the chip is smaller than the width thereof.

8. The self-scanning light-emitting element array chip according to claim 1 or 2 , wherein the pnpn layers include III-V compound semiconductor consisting of B, Al, Ga or In for III group element and N, P, As or Sb for V group element.

9. The self-scanning light-emitting element array chip according to claim 1 or 2 , wherein the pnpn layers Include II-VI compound semiconductor consisting of Zn or Cd for II group element and O, S, Se or Te for VI group element.

10. An optical writing heed, comprising:

a self-scanning light-emitting element array structured by arranging the self-scanning light-emitting element array chips of claim 1 or 2 , and

a lens array for projecting light from the self-scanning light-emitting element array.

11. An optical printer comprising:

an optical writing head of claim 10 ; and

a photosensitive drum onto which light from the self-scanning light-emitting element array is projected.

Assignments (4)
CHANGE OF NAME Recorded Jul 5, 2007
From: NIPPON SHEET GLASS CO., LTD.
To: NIPPON SHEET GLASS COMPANY, LIMITED
Reel/Frame 019529/0785 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2007
From: NIPPON SHEET GLASS COMPANY, LIMITED
To: FUJI XEROX CO., LTD.
Reel/Frame 019378/0840 →
CHANGE OF NAME Recorded Jan 5, 2005
From: NIPPON SHEET GLASS CO., LTD.
To: NIPPON SHEET GLASS COMPANY LIMITED
Reel/Frame 015540/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2004
From: OHNO, SEIJI
To: NIPPON SHEET GLASS CO., LTD.
Reel/Frame 016131/0028 →