High-frequency module, and method of producing same
A high-frequency module having a communication function is provided which includes a base substrate block ( 2 ) formed from organic substrates ( 11, 12 ), the organic substrate ( 11 ) having wiring layers ( 14, 15 ) formed on main sides, respectively, thereof while the organic substrate ( 12 ) has wiring layers ( 16, 17 ) formed on main sides, respectively, thereof, the base substrate block ( 2 ) having a buildup surface formed by flattening an uppermost layer, and an elements block ( 3 ) formed from organic insulative layers ( 26, 28 ) formed on the buildup surface of the base substrate block ( 2 ) and in which a plurality of conductive parts ( 19, 20, 32 ) forming passive elements and distributed parameter elements, which transmit a high-frequency signal, are formed along with wiring layers ( 27, 29 ). The conductive parts ( 19, 20, 32 ) in the elements block ( 3 ) are formed correspondingly to portions of the organic substrate ( 11 ) in the base substrate block ( 2 ) where no woven glass fabric is laid.
1. A high-frequency module comprising:
a first organic substrate having no glass fibers with conductive portions formed on top and bottom surfaces of the first organic substrate;
a second organic substrate having conductive portions formed on top and bottom surfaces of the second organic substrate;
a prepreg layer having no glass fibers exclusively located between the first and second organic substrates;
an insulating layer formed over the conductive portions formed at the top surface of the first organic substrate and wherein high frequency circuit components are formed over the insulating layer and there is no conductive portion on either the top or bottom surfaces of the first organic substrate located perpendicularly below high frequency circuit components that are formed over the insulating layer;
a high frequency integrated circuit located above the high frequency components and wherein conductors transmit electrical signals through the first and second organic substrates and the prepreg layer to conductive pads located beneath the second organic substrate.
2. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either liquid crystal polymer or liquid crystal polymer having a ceramic powder dispersed therein.
3. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either benzocyclobutene or benzocyclobutene having a ceramic powder dispersed therein.
4. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either polynorbornen or polynorbornen having a ceramic powder dispersed therein.
5. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either polyphenylether or polyphenylether having a ceramic powder dispersed therein.
6. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either polytetrafluoroethylene or polytetrafluoroethylene having a ceramic powder dispersed therein.
7. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from either bismaleimide-triazine or bismaleimide-triazine having a ceramic powder dispersed therein.
8. The high-frequency module according to claim 1 , wherein said first organic substrate is formed from polyimide having a ceramic powder dispersed therein.
9. The high frequency module of claim 1 , wherein the second organic substrate has glass fibers located therein.
10. The high frequency module of claim 1 , wherein the second organic substrate has no glass fibers located therein.
11. A method of manufacturing a high-frequency module comprising:
providing a first organic substrate having no glass fibers with conductive portions formed on top and bottom surfaces of the first organic substrate;
providing a second organic substrate having conductive portions formed on top and bottom surfaces of the second organic substrate;
forming a prepreg layer having no glass fibers exclusively located between the first and second organic substrates having the conductive portions formed thereon;
forming an insulating layer over the conductive portions formed at the top surface of the first organic substrate and forming high frequency circuit components over the insulating layer and wherein there is no conductive portion on either the top or bottom surfaces of the first organic substrate located perpendicularly below high frequency circuit components that are formed over the insulating layer;
providing a high frequency integrated circuit above the high frequency components and wherein conductors transmit electrical signals through the first and second organic substrates and the prepreg layer to conductive pads located beneath the second organic substrate.