A RF amplifier device ( 22 ) including an amplifier element ( 24 ) compensated by a compensating circuit ( 26, 28 ) with respect to its output capacitance and frequency decoupled from its power supply ( 26 ), wherein the decoupling circuit is directly connected to the compensating circuit ( 26, 28 ) and a RF amplifier device including an amplifier element ( 56, 80 ) and a compensating circuit comprising an internal shunt inductor having a compensating inductance ( 58, 60, 62 ) and a compensating capacitance ( 64, 92 ) and arranged in parallel to a terminal of the amplifier element ( 56, 80 ) to compensate a terminal capacitance of the amplifier element ( 56, 80 ), and a decoupling and power supply lead ( 76, 98 ) which is connected to the compensating capacitance ( 64, 92 ) and/or a decoupling circuit ( 100 ) and/or a combination of the compensating capacitance and the decoupling circuit ( 130 ) and a module thereof and a method for decoupling the mentioned RF amplifier device.
1. An RF amplifier device ( 22 ) comprising an amplifier element ( 24 ) with a frequency dependent gain, said frequency dependence being caused by an input and/or an output capacitance, said frequency dependence being compensated by a compensating circuit ( 26 , 28 ), said compensating circuit ( 26 , 28 ) for compensating for said frequency dependence being directly connected to a power supply connection terminal ( 36 ), said power supply connection terminal ( 36 ) being connected to a decoupling circuit ( 38 ).
2. A device as claimed in claim 1 , comprising an amplifier element ( 24 ) and a compensating circuit ( 26 , 28 ) comprising an internal shunt inductor having a compensating inductance ( 28 ) and a compensating capacitance ( 26 ), said compensating circuit being arranged in parallel to the amplifier element output ( 24 ) to compensate an input and/or an output capacitance of the device, said device further comprising a power supply terminal ( 36 ) connected to said amplifier element through said decoupling circuit ( 38 ), whereby the decoupling circuit ( 38 ) is coupled to the compensating capacitance ( 26 ) via said power supply terminal ( 36 ).
3. A device as claimed in claim 2 , wherein the decoupling circuit ( 38 ) is coupled to the compensating capacitance ( 26 ) through an inductance element ( 32 ).
4. A device as claimed in claim 2 , wherein the inductance element comprises at least one bond wire ( 28 , 32 , 40 ).
5. A device as claimed in claim 2 , wherein the decoupling circuit ( 38 ) is connected to ground ( 34 ) and the power supply ( 36 ).
6. A device as claimed in claim 3 , wherein the decoupling circuit comprises at least one decoupling capacitance ( 38 ).
7. A device as claimed in claim 2 , wherein a power supply line is provided comprising a power supply connection area, a decoupling circuit connection area and a bond wire connection area, which line is arranged next to the compensating capacitance ( 26 ).
8. A device as claimed in claim 2 , wherein said RF amplifier device ( 24 ) is a transistor.
9. A device as claimed in claim 1 , in which the amplifier element ( 24 ) with the compensating circuit ( 26 , 28 ), the decoupling circuit and the connection line having the connection area for a power supply ( 36 ) and a connection area for the decoupling circuit ( 38 ) are arranged on a circuit board, wherein the connection line is located on the circuit board next to the compensating capacitance ( 26 ).
10. A device as claimed in claim 1 , comprising an amplifier element ( 56 , 80 ) and a compensating circuit comprising an internal shunt inductor having a compensating inductance ( 58 , 60 , 62 ) in series with a compensating capacitance ( 64 , 92 ), which are arranged in parallel to a terminal of the amplifier element ( 56 , 80 ) to compensate a terminal capacitance of the amplifier element ( 56 , 80 ), said device further comprising a decoupling and power supply lead ( 76 , 98 ) connected to the compensating capacitance ( 64 , 92 ) and/or a decoupling circuit ( 100 ) and/or a combination of the compensating capacitance and the decoupling circuit ( 130 ).
11. A device as claimed in claim 10 , wherein the terminal of the amplifier element ( 56 , 80 ) is an input terminal and/or an output terminal of the amplifier element ( 56 , 80 ).
12. A device as claimed in claim 10 , wherein the decoupling circuit ( 100 ) is connected to the compensating capacitance ( 64 , 92 ) through an inductance element ( 58 , 60 , 62 , 82 , 84 , 86 ).
13. A device as claimed in claim 10 , wherein the inductance element comprises at least one bond wire ( 58 , 60 , 62 , 82 , 84 , 86 ).
14. A device as claimed in claim 10 , wherein the decoupling circuit ( 100 , 110 , 120 ) and/or the combination of the compensating capacitance and the decoupling circuit ( 130 ) are/is connected between the decoupling and power supply lead ( 76 , 98 ) and the compensating capacitance ( 64 , 92 ) or between the decoupling and power supply lead ( 76 , 98 ) and the terminal of the amplifier element ( 56 , 80 ).
15. A device as claimed in claim 10 , wherein the decoupling circuit comprises at least one decoupling capacitance ( 100 , 110 , 120 ).
16. A device as claimed in claim 10 , wherein the amplifier element ( 56 , 80 ) is a transistor.
17. A device as claimed in claim 1 , in which the amplifier element ( 56 , 80 ) with the compensating circuit and/or the decoupling circuit ( 100 , 110 , 120 ) and/or the combination of the compensating capacitance and the decoupling circuit ( 130 ) and the decoupling and power supply lead ( 76 , 98 ) are arranged on a circuit board.
18. A module comprising an RF amplifier device as claimed in claim 1 comprising
a mounting base ( 44 ) for a discrete transistor on which a printed circuit board (pcb) is soldered;
a matching network;
a bias circuit;
at least one decoupling capacitance.
19. A module as claimed in claim 18 , wherein the printed circuit board is a multilayer printed circuit board ( 200 ).
20. A module as claimed in claim 18 , wherein the printed circuit board ( 200 ) contains all or a part of the matching network and/or the bias circuit.
21. A module as claimed in claim 18 , wherein a signal path ( 206 ) is on a top layer ( 238 ) and a decoupling and power supply path ( 202 , 204 ) is on a middle layer ( 240 ) of the pcb ( 200 ) or vice versa.
22. A module as claimed in claim 18 , wherein the decoupling and power supply path ( 202 , 204 ) is in parallel to the dies of an amplifier element ( 210 , 212 ) and/or a compensating capacitance ( 214 , 216 ) and/or a decoupling circuit ( 208 ) and/or a combination of the compensating capacitance and the decoupling circuit ( 266 ).
23. A method for decoupling an RF amplifier device ( 22 ) comprising an amplifier element ( 24 ) with a frequency dependent gain, said frequency dependence being caused by an input and/or an output capacitance, said frequency dependence being compensated by a compensating circuit ( 26 , 28 ), said compensating circuit ( 26 , 28 ) for compensating for said frequency dependence being directly connected to a power supply connection terminal ( 36 ), said power supply connection terminal ( 36 ) being coupled to ground ( 34 ) via a frequency dependent impedance ( 38 ).