Method for producing a circuit board
View Patent ↗After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
1. A manufacturing method for a circuit board, comprising the steps of:
(a) placing a metallic foil on a prepreg sheet impregnated with a resin;
(b) heating and pressurizing said prepreg sheet and said metallic foil for a specific length of time at a first heating temperature set to a temperature in accordance with the softening temperature of the resin while pressurizing the prepreg sheet and said metallic foil after step (a) at a predetermined pressure; and
(c) heating and pressurizing the prepreg sheet after step (b) for a specific length of time at a second heating temperature higher than the first heating temperature.
2. The manufacturing method for a circuit board of claim 1 , further comprising the step of:
(d) heating and pressurizing the prepreg sheet after step (c) for a specific length of time at a third heating temperature higher than the second heating temperature.
3. The manufacturing method for a circuit board of claim 1 ,
wherein step (a) is such that the metallic foil is disposed on both surfaces of the prepreg sheet or the prepreg sheet is positioned and placed on both surfaces of respective circuit boards of two or more layers, followed by placing the metallic foil on outermost surfaces.
4. The manufacturing method for a circuit board of claim 1 ,
wherein the prepreg sheet is provided with conducting holes filled with conductive paste.
5. The manufacturing method for a circuit board of claim 4 ,
wherein the conductive paste contains conductive filler and thermosetting resin as main components, and
the softening point temperature of the thermosetting resin is lower than the softening point temperature of resin in the prepreg sheet.
6. The manufacturing method for a circuit board of claim 2 ,
wherein the third heating temperature is equivalent to the hardening temperature of the resin in the prepreg sheet.
7. The manufacturing method for a circuit board of claim 1 ,
wherein the prepreg sheet is in a state of B stage having compressibility.
8. The manufacturing method for a circuit board of claim 7 ,
wherein the substrate of the prepreg sheet is non-woven cloth of aromatic polyamide fiber.
9. The manufacturing method for a circuit board of claim 7 ,
wherein the substrate of the prepreg sheet is woven cloth or non-woven cloth of glass fiber.
10. The manufacturing method for a circuit board of claim 9 ,
wherein the compressibility of the prepreg sheet is less than 10%.