Silicone resin composition, curable resin composition, and curable resin
View Patent ↗The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
1. A curable resin composition comprising:
(I) crystalline epoxy resin,
(II) a silicone resin with a softening point exceeding 25° C., represented by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , wherein R 1 , R 2 , and (R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups such that, of the total number of R 1 , R 2 , and R 3 groups in the molecule. 0.1 to 40 mol% comprises epoxy-containing organic groups and not less than 10 mol% comprises phenyl groups, X is selected from the group consisting of a hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 0.4, and
(III) a silicone resin that is liquid at 25° C.
2. The curable resin composition set forth in claim 1 , wherein component (III) is a silicone resin represented by average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where R 1 , R 2 , and R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups, X is selected from the group consisting of hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
3. The curable resin composition set forth in claim 2 , wherein the amount of component (II) is 0.1 to 500 parts by weight and that of component (III) is 0.15 to 200 parts by weight per 100 parts by weight of component (I).
4. The curable resin composition set forth in claim 1 , wherein component (I) is a mixture of epoxy resin and phenolic resin.
5. The curable resin composition set forth in claim 1 , wherein component (I) is a mixture of a biphenyl type epoxy resin and a phenol aralkyl type epoxy resin.
6. The curable resin composition set forth in claim 1 , wherein not less than 10 mol % of R 1 in component (II) comprises phenyl groups.
7. The curable resin composition set forth in claim 6 , wherein the viscosity of component (III) at 25° C. is 5 to 100,000 mPa·s.
8. The curable resin composition set forth in claim 6 , wherein the amount of component (II) is 0.1 to 500 parts by weight and that of component (III) is 0.15 to 200 parts by weight per 100 parts by weight of component (I).
9. The curable resin composition set forth in claim 6 , wherein component (III) is a silicone resin represented by average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where R 1 , R 2 , and R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups, X is selected from the group consisting of hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
10. The curable resin composition set forth in claim 1 , wherein the viscosity of component (III) at 25° C. is 5 to 100,000 mPa·s.
11. The curable resin composition set forth in claim 10 , wherein the amount of component (II) is 0.1 to 500 parts by weight and that of component (III) is 0.15 to 200 parts by weight per 100 parts by weight of component (I).
12. The curable resin composition set forth in claim 10 , wherein component (III) is a silicone resin represented by average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where R 1 , R 2 , and R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups, X is selected from the group consisting of hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
13. The curable resin composition set forth in claim 1 , wherein the amount of component (II) is 0.1 to 500 parts by weight and that of component (III) is 0.15 to 200 parts by weight per 100 parts by weight of component (I).
14. A cured resin obtained by curing the curable resin composition according to claim 1 .
15. A cured resin obtained by curing the curable resin composition according to claim 6 .
16. A cured resin obtained by curing the curable resin composition according to claim 10 .
17. A cured resin obtained by curing the curable resin composition according to claim 2 .
18. A cured resin obtained by curing the curable resin composition according to claim 13 .
19. A curable resin composition comprising:
(I) a mixture of a biphenyl type epoxy resin and a phenol aralkyl type epoxy resin,
(II) a silicone resin with a softening point exceeding 25° C. represented by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) c , wherein R 1 , R 2 , and R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups such that, of the total number of R 1 , R 2 , and groups in the molecule. 0.1 to 40 mol% comprises epoxy-containing organic groups and not less than 10 mol% comprises phenyl groups, X is selected from the group consisting of a hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 0.4, and
(III) a silicone resin that is liquid at 25° C.
20. The curable resin composition set forth in claim 19 , wherein not less than 10 mol % of R 1 in component (II) comprises phenyl groups.
21. The curable resin composition set forth in claim 19 , wherein component (III) is a silicone resin represented by average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e , where R 1 , R 2 , and R 3 are independently selected from the group consisting of monovalent hydrocarbon groups and epoxy-containing organic groups, X is selected from the group consisting hydrogen atom and alkyl group, a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, and e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
22. The curable resin composition set forth in claim 19 , wherein the viscosity of component (III) at 25° C. is 5 to 100,000 mPa·s.
23. The curable resin composition set forth in claim 19 , wherein the amount of component (II) is 0.1 to 500 parts by weight and that of component (III) is 0.15 to 200 parts by weight per 100 parts by weight of component (I).
24. A cured resin obtained by curing the curable resin composition according to claim 19 .