Print assembly for a wide format pagewidth printer
View Patent ↗A print assembly ( 14 ) for a wide format printer ( 10 ) includes a carrier ( 187 ) that is mountable on a support structure ( 12 ) of the wide format printer ( 10 ) in an operative position with respect to a platen ( 106 ) of the wide format printer ( 10 ). A number of printhead chips ( 186 ) are positioned on the carrier ( 187 ), the printhead chips ( 186 ) together incorporating at least fifty thousand nozzle arrangements ( 210 ). The printhead chips ( 186 ) are positioned so that the printhead chips ( 186 ) are capable of ejecting ink drops into a printing zone ( 120 ) defined by the platen ( 106 ). Control circuitry ( 190 ) is also positioned on the carrier ( 187 ) and is configured to control operation of the printhead chips ( 186 ).
1. A print assembly for a wide format printer, the print assembly comprising
a plurality of printhead modules, each of the plurality of printhead modules incorporating a printhead chip and an elongate carrier that is mountable on a support structure of the printer in an operative position with respect to a platen of the wide format printer and
the plurality of modules together incorporating at least fifty thousand nozzle arrangements, the printhead chip of each of the plurality of modules being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen; and,
a flexible printed circuit board (PCB) that is also positioned on each of the plurality of printhead modules and that is configured to control operation of the printhead chips;
wherein each printhead chip is the product of an integrated circuit fabrication process, and each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the water substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer.
2. A print assembly as claimed in claim 1 , in which the printhead chips together incorporate at least one hundred thousand nozzle arrangements.
3. A print assembly as claimed in claim 2 , in which the printhead chips together incorporate at least two hundred thousand nozzle arrangements.
4. A print assembly as claimed in claim 3 , which includes between forty and one hundred printhead chips positioned on the carrier.
5. A print assembly as claimed in claim 1 , in which each nozzle arrangement is in the form of a micro electro-mechanical system that is electrically connected to the CMOS drive circuitry layer.
6. A print assembly as claimed in claim 1 , in which the flexible printed circuit board (PCB) is connected between the CMOS drive circuitry layer of each printhead chip and control circuitry.
7. A print assembly as claimed in claim 1 , in which the printhead modules are configured so that the printhead chips are each positioned at a common angle of greater than zero degrees and less than ninety degrees with respect to a line extending a length of the printing zone, so that consecutive printhead chips overlap at their ends.
8. A wide format printer that comprises
a support structure;
a print assembly positioned on the support structure, the print assembly comprising
a plurality of printhead modules, each of the plurality of printhead modules incorporating a printhead chip and a carrier that is mounted in an operative position with respect to a platen of the wide format printer, the plurality of modules together incorporating at least fifty thousand nozzle arrangements, the printhead chip of each of the plurality of modules being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen;
a flexible printed circuit board (PCB) that is also positioned on each of the plurality of modules and that is configured to control operation of the printhead chips; and,
a media feed mechanism positioned on the support structure to feed media into the print assembly;
wherein each printhead chip is the product of an integrated circuit fabrication process and each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the wafer substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer.