Ink jet printhead chip with predetermined micro-electromechanical systems height
View Patent ↗An inkjet printhead chip includes a wafer substrate ( 12 ). A CMOS drive circuitry layer is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate and the CMOS drive circuitry layer. Each nozzle arrangement includes nozzle chamber walls and a roof wall that define a nozzle chamber and an ink ejection port ( 35 ) defined in the roof wall. A micro-electromechanical actuator ( 14 ) is connected to the CMOS drive circuitry layer. The actuator has at least one movable member ( 14 ) that is positioned to act on ink in the nozzle chamber to eject the ink from the ink ejection port on receipt of a signal from the drive circuitry layer. The movable member is spaced between 2 microns and 15 microns from the CMOS drive circuitry layer.
1. An inkjet printhead chip comprising:
a wafer substrate,
a CMOS drive circuitry layer positioned on the wafer substrate, and
a plurality of nozzle arrangements, each having a chamber for containing ink, an ink ejection port and a thermal bend actuator electrically connected to, and spaced from, the CMOS drive circuitry layer such that actuation of the thermal bend actuator causes it to move relative to the wafer substrate and thereby eject ink through the ink ejection port; wherein,
in its quiescent state, the thermal bend actuator is spaced between 2 microns and 15microns from the CMOS drive circuitry layer.
2. An inkjet printhead chip as claimed in claim 1 wherein the thermal bend actuator is spaced between 5 microns and 12 microns from the CMOS drive circuitry layer.
3. An inkjet printhead chip as claimed in claim 2 , wherein the thermal bend actuator is spaced between 6 microns and 10 microns from the CMOS drive circuitry layer.
4. An inkjet printhead chip as claimed in claim 1 wherein the chambers are defined by four chamber walls extending normal to the CMOS drive circuitry layer and a roof wall extending between the distal edges of the chamber walls such that the ink ejection port is form in the roof wall, and the chamber is generally rectangular in plan and transverse cross section, and thermal bend actuator is planar, rectangular and cantilevered in the chamber with its free end between the CMOS drive circuitry layer and the ink ejection port and its fixed end anchored to electrodes connecting it to the CMOS drive circuitry layer, the thermal bend actuator incorporating heating circuitry for heating by signals received from the CMOS drive circuitry layer, to displace the free end towards the ink ejection port as a result of differential expansion and, when the signal is terminated, the free end is displaced away from the ink ejection port as a result of differential contraction.
5. An ink jet printhead chip as claimed in claim 1 wherein the chambers are defined by four chamber walls extending normal to the CMOS drive circuitry layer and a roof wall extending between the distal edges of the chamber walls such that the ink ejection port is form in the roof wall, and the chamber is generally rectangular in plan and transverse cross section, and thermal bend actuator is planar, rectangular and cantilevered in the chamber with its free end between the CMOS drive circuitry layer and the ink ejection port and its fixed end anchored to electrodes connecting it to the CMOS drive circuitry layer, the thermal bend actuator comprises an actuator arm of a conductive material that is configured to define a heating circuit that is electrically connected to the CMOS drive circuitry layer and is configured to deflect towards the wafer substrate as a result of differential expansion when an electrical signal is received from the CMOS drive circuitry layer, and the roof wall of the nozzle chamber and at least part of the nozzle chamber walls connected to the actuator arm, so that, when the actuator arm is deflected towards the wafer substrate, ink is ejected from the ink ejection port defined in the roof wall.
6. An ink jet printhead that includes a plurality of printhead chips as claimed in claim 1 .