Printed wiring board
View Patent ↗The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad, and a region except the pad is used as a circuit wire. The opening has opposite ends extending in a first direction beyond the electrically conductive pattern such that opposite ends of the pad in the first direction are defined by the electrically conductive pattern, and further has opposite ends extending in a second direction perpendicular to the first direction to intersect with the electrically conductive pattern such that the pad is defined in shape in the second direction by the opposite ends of the opening extending in the second direction. The pad is smaller in length in the first direction than the circuit wire.
1. A printed wiring board comprising:
a substrate;
an electrically conductive pattern formed on said substrate; and
an electrical insulator covering said substrate and said electrically conductive pattern therewith,
wherein a region of said electrically conductive pattern exposed through an opening formed throughout said electrical insulator is used as a pad used for electrically connecting said printed wiring board to a device to be mounted on said substrate, and a region except said pad is used as a circuit wire,
said opening is formed so as to separately expose said electrically conductive pattern,
said opening has opposite ends extending in a first direction beyond said electrically conductive pattern having a width equal to that of said circuit wire such that opposite ends of said pad in said first direction are defined by said electrically conductive pattern,
said opening further has opposite ends extending in a second direction perpendicular to said first direction to intersect with said electrically conductive pattern such that said pad is defined in shape in said second direction by said opposite ends of said opening extending in said second direction, and
said pad is smaller in length in said first direction than said circuit wire.