IP Library Granted Patent US 7,190,571
Granted Patent B2
US 7,190,571 · App. 10/514,788 · Granted Mar 13, 2007

Chip capacitor and method for the production thereof

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Quick Facts
Patent No.
US 7,190,571
App. No.
10/514,788
Granted
Mar 13, 2007
Kind
B2
Abstract

A capacitor includes a first capacitor element, a first anode contact for the first capacitor element, the first anode contact protruding from the first capacitor element, a second capacitor element, and a second anode contact for the second capacitor element, the second anode contact protruding from the second capacitor element. The capacitor also includes a cathode contact. The first and second capacitor elements are stacked, and a side of at least one capacitor element is attached to the cathode contact.

Claims (20)

1. An electrolytic chip capacitor comprising:

a first capacitor element;

a first anode contact for said first capacitor element extending from said first capacitor element;

a second capacitor element;

a second anode contact for said second capacitor element, extending from said second capacitor element parallel to said first anode contact; and

a cathode contact;

an anode connection having a plurality of stepped recesses to receive said anode contacts

wherein said first and second capacitor elements are stacked;

wherein at least one capacitor element is attached to said cathode contact; and

wherein said first and second anode contacts are laterally offset relative to one another and said recesses in said anode connection are laterally offset correspondingly.

2. A chip capacitor according to claim 1 wherein at least one stacked capacitor element is attached to said cathode contact using a conductive adhesive.

3. A chip capacitor according to claim 2 wherein said first and second capacitor elements are attached to different sides of said cathode contact.

4. A chip capacitor according to claim 2 wherein said first and second capacitor elements are attached to each other using a conductive adhesive.

5. A chip capacitor according to claim 1 wherein said anode contacts extend beyond the anode connection.

6. A chip capacitor according to claim 1 wherein said anode connection comprises a metal sheet and wherein said recesses comprise V-shaped segments in said sheet metal, said sheet metal being bent such that a portion thereof is substantially parallel to said cathode contact.

7. A chip capacitor according to clam 6 wherein all of said capacitor elements are on one side of said anode connection.

8. A chip capacitor according to claim 6 wherein said capacitor elements are on different sides of said anode connection.

9. A chip capacitor according to claim 6 wherein said cathode contact is serially connected with each capacitor element using a conductive adhesive.

10. An electrolytic chip capacitor comprising a plurality of stacked capacitor elements, each capacitor element having an anode contact protruding therefrom, at least one cathode contact serially connected to said plurality of capacitor elements, and an anode connection in contact with each of said anode contacts, wherein each of said anode contacts is laterally offset from each other anode contact on the same side of said anode connection, said anode connection having recesses disposed laterally corresponding to said anode contact.

11. An electrolytic chip capacitor according to claim 10 wherein said recesses in said anode connection are stepped.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
SECURITY INTEREST Recorded Oct 5, 2010
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A. AS AGENT
Reel/Frame 025150/0023 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 022892/0795 Recorded May 18, 2010
From: K FINANCING, LLC
To: KEMET CORPORATION
Reel/Frame 024397/0774 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: KEMET CORPORATION
To: K FINANCING, LLC
Reel/Frame 022892/0795 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2007
From: KEMET ELECTRONICS GMBH
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 019511/0702 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2007
From: EPCOS AG
To: KEMET ELECTRONICS GMBH
Reel/Frame 019477/0762 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2004
From: HEUSMANN, HANS; NUNES, RUI
To: EPCOS AG
Reel/Frame 016551/0366 →