Integrated circuit and method for manufacturing same
An integrated circuit having at least one microstrip line and at least one port, and a method of manufacturing the circuit are used, in particular, for test passes for development purposes during chip production and also during chip manufacture. At least some of the ports and/or microstrip lines in the integrated circuit have a removable, reflection-free termination which is integrated on the chip. The integrated circuit is produced in a first step, with at least some of the ports and/or microstrip lines in the integrated circuit being provided with a removable, reflection-free termination which is integrated on the chip, and in a second step for this termination to be removed from a prescribable selection of the ports and/or microstrip lines.
1 - 22 . (canceled)
23 . An integrated circuit, comprising: at least one microstrip line; at least one port; and a removable, reflection-free termination integrated on a chip, for terminating at least one of the microstrip line and the port.
24 . The integrated circuit according to claim 23 , in that the integrated circuit is a microwave monolithic integrated circuit.
25 . The integrated circuit according to claim 23 , in that the integrated circuit is a radio-frequency circuit.
26 . The integrated circuit according to claim 23 , in that the integrated circuit is a test circuit.
27 . The integrated circuit according to claim 23 , in that the at least one port is a coplanar line port.
28 . The integrated circuit according to claim 23 , and comprising at least one of an amplifier, a mixer, a coupler, and a power splitter.
29 . The integrated circuit according to claim 23 , in that there is a plurality of microstrip lines, ports and terminations, each of the microstrip lines and ports being terminated by a respective one of the terminations.
30 . The integrated circuit according to claim 23 , and comprising input Lange couplers on the chip, the couplers having at least one port terminated by the termination.
31 . The integrated circuit according to claim 23 , in that the termination is an absorbing resistor.
32 . The integrated circuit according to claim 23 , in that there is a plurality of reflection-free terminations arranged symmetrically with respect to radio-frequency signal lines.
33 . A method of manufacturing an integrated circuit, comprising the steps of: integrating at least one microstrip line, at least one port, and at least one removable, reflection-free termination on a chip; and removing the termination from a prescribable selection of at least one of the microstrip line and the port.
34 . The method according to claim 33 , in that the integrating step is performed by integrating a plurality of microstrip lines, a plurality of ports, and a plurality of terminations on the chip, and by terminating each of the lines and the ports with a respective one of the terminations.
35 . The method according to claim 34 , in that the terminating step is performed by using absorbing resistors as the terminations.
36 . The method according to claim 34 , in that the terminating step is performed by selecting and optimizing a position and dimensions of the terminations to be reflection-free.
37 . The method according to claim 34 , and arranging the terminations symmetrically with respect to radio-frequency signal lines.
38 . The method according to claim 34 , in that the removing step is performed by a laser.
39 . The method according to claim 34 , in that the removing step is performed in response to requirements of measurement arrangements used for making contact with radio-frequency connections.
40 . The method according to claim 34 , in that, following removal of the terminations, performing the step of connecting the ports and microstrip lines to a measurement device.
41 . The method according to claim 40 , in that a radio-frequency connection is used as a connection to the measurement device.
42 . The method according to claim 40 , and the step of using the measurement device to test individual parts of the integrated circuit, individually on their own.
43 . The method according to claim 34 , in that the removal step stipulates properties of the integrated circuit.
44 . The method according to claim 34 , in that the removal step stipulates a suppressed sideband of a mixer.