Planarization films for advanced microelectronic applications and devices and methods of production thereof
View Patent ↗A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.
1. A film comprising a planarization composition wherein the planarization composition consists of:
an o-cresol-based polymer compound and a resol phenolic resin;
at least one surfactant; and
a solvent system consisting of at least one solvent, wherein at least some of the solvent system is removed.
2. A layered component, comprising:
a substrate having a surface topography; and
a planarization composition consisting of:
an o-cresol-based polymer compound and a resol phenolic resin;
at least one surfactant; and
a solvent system consisting of at least one solvent, and wherein the composition is coupled to the substrate.
3. The layered component of claim 2 , further comprising at least one additional layer of material or film.
4. A layered component, comprising:
a substrate having a surface topography; and
a layer comprising the film of claim 1 , wherein the layer is coupled to the substrate.
5. The layered component of claim 4 , further comprising at least one additional layer of material or film.
6. A method of forming a film, comprising:
providing a planarization composition consisting of:
an o-cresol-based polymer compound and a resol phenolic resin;
at least one surfactant; and
a solvent system consisting of at least one solvent, and evaporating at least part of the solvent system to form a film.
7. The method of claim 6 , wherein evaporating at least part of the solvent system comprises applying a continuous source to the planarization composition.
8. The method of claim 7 , wherein the continuous source comprises a heat source.
9. The method of claim 8 , wherein the continuous source comprises an infrared source, an ultraviolet source, an electron-beam source and combinations thereof.