A plain bearing and method for making the plain bearing are described, the plain bearing having an overlay alloy layer at a sliding surface of the plain bearing, the plain bearing comprising a layer of a strong backing material, a layer of a first bearing alloy bonded to the strong backing material and a layer of a second bearing material comprising said overlay material bonded to said first bearing alloy layer wherein said second bearing material comprises tin having included in the matrix thereof an organic levelling agent.
1. A method for the deposition of an overlay layer onto the surface of a plain bearing, the bearing comprising a strong backing material having a layer of a first bearing material thereon, said overlay being deposited upon the surface of said first bearing material, the method comprising the steps of:
providing a bearing having a surface on which to deposit said overlay;
immersing said bearing in a plating solution having a supply of tin ions and an organic levelling agent in said solution;
making said bearing cathodic with respect to an anode in said solution; and
depositing an overlay of tin, apart from unavoidable impurities, said tin overlay also having said organic levelling agent included in a matrix thereof.
2. A method according to claim 1 , wherein the overlay is deposited in a slot jig apparatus.
3. A method according to claim 2 , wherein the plating solution is sparged through the slot towards the bearing bore.
4. A method according to claim 2 , wherein a plating current density lies in the range from about 2 to 3 A/dm 2 .
5. A method according to claim 1 , wherein a plating current density lies in the range from about 2 to 3 A/dm 2 .
6. A method for manufacturing a plain bearing comprising a strong backing material having a layer of a first bearing material thereon on which a interlayer material is provided to act as a diffusion barrier, the method comprising the steps of:
immersing said plain bearing in a plating solution having a supply of tin ions and an organic levelling agent in said solution;
making said plain bearing cathodic with respect to an anode in said solution; and depositing an overlay of tin, apart from unavoidable impurities, on the surface of said first bearing material, said tin overlay also having said organic levelling agent included in a matrix thereof, characterized in that the organic levelling agent is one of nonylphenolpolyglycolether and pyrocatechol.
7. A method according to claim 6 , wherein the interlayer is selected from the group comprising: nickel, cobalt, copper, silver, iron, and alloys thereof.
8. A method according to claim 7 , wherein the plating solution has the following composition:
Sn ++
32–38 g/l
SnSO 4
58–68 g/l
H2SO 4
185–210 g/l
Cu
<50 mg/l
Cl-
<20 parts per million (ppm), and
an organic levelling agent, being nonylphenolpolyglycolether in a methanol carrier in the range front 25–55 ml/l.
9. A method according to claim 6 , wherein the plating solution has the following composition:
Sn ++
32–38 g/l
SnSO 4
58–68 g/l
H2SO 4
185–210 g/l
Cu
<50 mg/l
Cl-
<20 parts per million (ppm), and
an organic levelling agent, being nonylphenolpolyglycolether in a methanol carrier in the range from 25–55 ml/l.
10. A method according to claim 6 , wherein the overlay is deposited in a slot jig apparatus.
11. A method according to claim 6 , wherein the plating solution is sparged through the slot towards the bearing bore.
12. A method according to claim 6 , wherein a plating current density lies in the range from 2 to 3 A/dm 2 .
13. A method according to claim 6 , wherein the plating solution is sparged through the slot towards the bearing bore and wherein a plating current density lies in the range from 2 to 3 A/dm 2 .
14. A plain bearing made by the method of claim 6 .