IP Library Granted Patent US 7,580,030
Granted Patent B2
US 7,580,030 · App. 10/528,512 · Granted Aug 25, 2009

Sensor for capacitive touch pad pointing device

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Quick Facts
Patent No.
US 7,580,030
App. No.
10/528,512
Granted
Aug 25, 2009
Kind
B2
Abstract

The topology and the shape of sensing electrodes ( 4, 31 ) on the Capacity Touch Pad Sensor that allow sensing of small targets are disclosed. Sensor construction utilizes common PCB manufacture technique.

Claims (65)

1. A capacitive touch pad comprising cover and first layers,

the cover layer comprising a non-conductive cover providing galvanic isolation of the first layer,

the first layer comprising a plurality of row-shaped row-sensing electrodes and a row-by-column array of column-sensing electrodes,

each column of column-sensing electrodes interconnected by conductive traces,

the row-sensing electrodes and column-sensing electrodes defining interleaved combs therebetween,

each column-sensing electrode overlapping at least two row-shaped, row-sensing electrodes,

each comb comprising at least two fingers.

2. The capacitive touch pad of claim 1 wherein the fingers are no wider than eight mils.

3. The capacitive touch pad of claim 1 wherein the fingers define spaces therebetween, and the spaces are no wider than eight mils.

4. The capacitive touch pad of claim 1 further comprising a second layer, the first layer lying between the cover and second layers, the second layer comprising a ground plane.

5. The capacitive touch pad of claim 4 further comprising a third layer, the second layer lying between the first and third layers, the third layer bearing circuitry.

6. The capacitive touch pad of claim 1 wherein in the first layer further comprises annular copper around the electrodes.

7. The capacitive touch pad of claim 6 wherein the annular copper is connected to ground potential.

8. The capacitive touch pad of claim 4 further comprising an isolator/dielectric layer between the first and second layers.

9. The capacitive touch pad of claim 5 further comprising an isolator/dielectric layer between the second and third layers.

10. The capacitive touch pad of claim 1 wherein the number of rows is at least three and the number of columns is at least three.

11. The capacitive touch pad of claim 10 wherein the number of rows is at least eleven and the number of columns is at least thirteen.

12. A capacitive touch pad comprising cover and first layers,

the cover layer comprising a non-conductive cover providing galvanic isolation of the first layer,

the first layer comprising a plurality of row-shaped row-sensing electrodes and a row-by-column away of column-sensing electrodes,

each column of column-sensing electrodes interconnected by conductive traces, the row-sensing electrodes and column-sensing electrodes defining interleaved combs therebetween,

each column-sensing electrode overlapping at least two row-shaped, row-sensing electrodes,

each comb comprising at least two fingers,

the touch pad further comprising a second layer,

the first layer lying between the cover and second layers,

the second layer comprising a ground plane.

13. The capacitive touch pad of claim 12 further comprising a third layer,

the second layer lying between the first and third layers,

the third layer bearing circuitry.

14. A capacitive touch pad comprising cover and first layers,

the cover layer comprising a non-conductive cover providing galvanic isolation of the first layer,

the first layer comprising a plurality of row-shaped row-sensing electrodes and a row-by-column array of column-sensing electrodes,

each column of column-sensing electrodes interconnected by conductive traces, the row-sensing electrodes and column-sensing electrodes defining interleaved combs therebetween,

each column-sensing electrode overlapping at least two row-shaped, row-sensing electrodes,

each comb comprising at least two fingers,

wherein in the first layer further comprises annular copper around the electrodes.

15. The capacitive touch pad of claim 14 wherein the annular copper is connected to ground potential.

16. The capacitive touch pad of claim 12 further comprising an isolator/dielectric layer between the first and second layers.

17. The capacitive touch pad of claim 13 further comprising an isolator/dielectric layer between the second and third layers.

18. A capacitive touch pad,

the touch pad defining top, bottom, left, and right edges,

the pad comprising cover and first layers,

the cover layer comprising a non-conductive cover providing galvanic isolation of the first layer,

the first layer comprising a plurality of row-shaped row-sensing electrodes each extending toward the left and right edges, and a row-by-column array of column-sensing electrodes,

each column of column-sensing electrodes interconnected by conductive traces,

the row-sensing electrodes and column-sensing electrodes defining interleaved combs therebetween,

each column-sensing electrode overlapping at least two row-shaped, row-sensing electrodes,

each comb comprising at least two fingers,

at least one regular row-shaped row-sensing electrode having fingers extending toward the top edge and having fingers extending toward the bottom edge,

at least one row of column-sensing electrodes having fingers extending toward the top edge and having fingers extending toward the top edge.

19. The capacitive touch pad of claim 18 wherein the fingers are no wider than eight mils.

20. The capacitive touch pad of claim 18 wherein the fingers define spaces therebetween, and the spaces are no wider than eight mils.

21. The capacitive touch pad of claim 18 further comprising a second layer,

the first layer lying between the cover and second layers,

the second layer comprising a ground plane.

22. The capacitive touch pad of claim 21 further comprising a third layer,

the second layer lying between the first and third layers,

the third layer bearing circuitry.

23. The capacitive touch pad of claim 18 wherein the first layer further comprises annular copper around the electrodes.

24. The capacitive touch pad of claim 23 wherein the annular copper is connected to ground potential.

25. The capacitive touch pad of claim 21 further comprising an isolator/dielectric layer between the first and second layers.

26. The capacitive touch pad of claim 22 further comprising an isolator/dielectric layer between the second and third layers.

27. The capacitive touch pad of claim 18 wherein the number of rows is at least three and the number of columns is at least three.

28. The capacitive touch pad of claim 27 wherein the number of rows is at least eleven and the number of columns is at least thirteen.

29. The capacitive touch pad of claim 18 wherein each of the column-sensing electrodes has fingers extending toward the top edge and has fingers extending toward the bottom edge.

Assignments (5)
ASSIGNMENT OF PATENT SECURITY INTEREST PREVIOUSLY RECORDED AT REEL/FRAME (040646/0799) Recorded Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0544 →
SECURITY INTEREST Recorded Nov 17, 2016
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.; TRIUNE SYSTEMS, L.L.C.; TRIUNE IP, LLC
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 040646/0799 →
RELEASE OF SECURITY INTEREST Recorded May 2, 2013
From: JEFFERIES FINANCE LLC
To: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
Reel/Frame 030341/0059 →
SECURITY AGREEMENT Recorded May 2, 2013
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 030341/0099 →
GRANT OF SECURITY INTEREST Recorded Mar 20, 2012
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 027897/0141 →