IP Library Granted Patent US 7,587,803
Granted Patent B2
US 7,587,803 · App. 10/529,181 · Granted Sep 15, 2009

Method for assembling a camera module

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Quick Facts
Patent No.
US 7,587,803
App. No.
10/529,181
Granted
Sep 15, 2009
Kind
B2
Abstract

A process for assembling a camera module comprises the following steps:—placing the substrate ( 10 ) on a positioning die ( 70 );—irradiating the lens assembly ( 30 ) with parallel rays of light ( 90 );—displacing a lens assembly ( 30 ) comprising the convex lens ( 33 ) in an axial direction;—measuring the light intensity of light passing through a spot hole ( 75 ) by means of a light sensor ( 80 ) being accommodated in the positioning die ( 70 );—determining an optimal axial position of the lens assembly ( 30 ) on the basis of an obtained light intensity curve;—bringing the lens assembly ( 30 ) to the optimal axial position;—removing the positioning die ( 70 ); and—attaching an image sensor chip to a bottom surface ( 12 ) of the substrate ( 10 ).

Claims (16)

1. Method for assembling a camera module comprising a substrate, a lens and an image sensor chip having a light-sensitive surface, wherein in an assembled state an optical axis of the lens extends in a z-direction and the light-sensitive surface of the image sensor chip extends at a pre-determined sensor surface position perpendicular to the z-direction, the method comprising the following steps:

a) aligning a detector of a measuring device with the optical axis of the lens;

b) displacing the lens in the z-direction;

c) determining an optimal z-position for the lens on the basis of measuring signals from the measuring device, wherein measuring is performed at a measuring position;

d) bringing the lens to the optimal z-position, and fixing the lens with respect to the substrate;

e) removing the measuring device; and

f) attaching the image sensor chip to the substrate, wherein the measuring device is removed before the image sensor chip is attached to the substrate, so as to align the light-sensitive surface of the image sensor chip with the optical axis of the lens.

2. Method according to claim 1 , wherein the measuring device is positioned at a bottom surface of the substrate.

3. Method according to claim 1 , wherein the measuring device comprises a diaphragm opening aligned with the optical axis of the lens, and a light sensor receiving all light passing through the diaphragm opening, and wherein step c) comprises the step of determining the light intensity detected by the light sensor as a function of the lens position.

4. Method according to claim 1 , further comprising the step of determining a maximum light intensity.

5. Method according to claim 1 , wherein the measuring position coincides with the sensor surface position, and wherein the displacement of the lens is stopped as soon as the optimal z-position is reached.

6. Method according to claim 4 , wherein the measuring position coincides with the sensor surface position, wherein displacement of the lens is continued after having reached the optimal z-position, wherein step c) comprises the step of calculating a distance between the present z-position and the optimal z-position, and wherein step d) comprises the step of displacing the lens in an opposite direction over the calculated distance.

7. Method according to claim 4 , wherein the measuring position is above the sensor surface position, at a pre-determined distance ΔZ 2 , wherein displacement of the lens is continued after having reached a reference z-position at which the measuring signals have a maximum value, wherein step c) comprises the step of calculating a distance ΔZ 1 between the present z-position and the reference z-position, and wherein step d) comprises the step of displacing the lens over a distance ΔZ 2 -ΔZ 1 .

8. Method according to claim 1 , wherein the displacement of the lens takes place step by step.

9. Method according to claim 8 , wherein the measuring position is at a pre-determined distance ΔZ 2 from the sensor surface position, and wherein the predetermined distance ΔZ 2 is larger than one step of the displacement of the lens.

10. Method, preferably according to claim 1 , wherein a lens assembly having a lens is press-fitted in a mount, which is fixedly attached to a substrate or an integral part thereof, the method comprising the step of pushing the lens assembly into the mount until the lens has reached a desired position.

Assignments (4)
CHANGE OF NAME Recorded Apr 7, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032621/0718 →
MERGER Recorded Feb 15, 2011
From: TPO DISPLAYS CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 025809/0444 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2008
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: TPO DISPLAYS CORP.
Reel/Frame 021194/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2005
From: MONTFORT, VINCENT J. J.; VERWEG, FRANSISCUS G. C.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 017175/0906 →