Film comprising organic semiconductors
View Patent ↗The invention concerns a film ( 1 ), in particular a stamping or laminating film, and a process for the production of such a film. At least one component produced using organic semiconductor technology, in particular one or more organic field effect transistors, is integrated into a film ( 1 ).
1. A process for the production of a film comprising:
producing at least one component using organic semiconductor technology, wherein the at least one component includes a plurality of layers and wherein the plurality of layers includes at least one electrical functional layer; and
spatially structuring one or more of the plurality of layers by means of thermal replication or UV replication to form a spatial structure in a replicated layer, wherein a part of at least one electrical functional layer is completely severed in the region of the spatial structure and wherein the spatial structure has a structure depth that is greater than the thickness of the replicated layer, so that the replicated layer is completely severed in part by the replication operation and an electrical functional layer which is structured in a pattern configuration in accordance with the spatial structure is formed.
2. The process as set forth in claim 1 , wherein the spatial structure is replicated in an electrode layer comprising an electrically conductive material and wherein the process further comprises applying a second electrical functional layer comprising a non-conducting or semiconducting material to said electrode layer.
3. The process as set forth in claim 1 further comprising applying to the replicated layer a second electrical functional layer of a material which upon hardening experiences a pre-defined reduction in volume, and that said material is applied to the replicated layer in an application amount with which upon hardening a functional layer which is structured in a pattern configuration in accordance with the spatial structure remains by virtue of the shrinkage in volume.
4. The process as set forth in claim 3 , wherein the second functional layer comprises an UV-hardenable material.
5. The process as set forth in claim 1 further comprising applying a second electrical functional layer to the replicated layer and removing the second electrical functional layer to a depth such that there remains a functional layer which is structured in a pattern configuration in accordance with the spatial structure.
6. The process as set forth in claim 1 , wherein the electrical functional layer comprises a non-conducting or semiconducting material and wherein the process farther comprises applying an electrode layer comprising a conductive material to said electrical functional layer.
7. The process as set forth in claim 1 , wherein an electrical functionality and an optical functionality are produced by a replication operation.
8. A process for the production of a film comprising:
producing at least one component using organic semiconductor technology, wherein the at least one component includes a plurality of layers and wherein the plurality of layers includes at least one electrical functional layer; and
spatially structuring one or more of the plurality of layers by means of thermal replication or UV replication to form a spatial structure in a replicated layer, wherein a part of at least one electrical functional layer is completely severed in the region of the spatial structure, and wherein the spatial structure has a structure depth that is greater than the thickness of the replicated layer, so that the replicated layer is completely severed in part by the replication operation and an electrical functional layer which is structured in a pattern configuration in accordance with the spatial structure is formed,
wherein at least one of the plurality of layers is introduced into a film structure having a surface area over the entire surface area or part of the surface area by a printing process.