Method of manufacturing a data carrier
View Patent ↗A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.
1. A support strip comprising:
at least one roughly parallel gripping area; and
a first support element and at least a second support element,
wherein the first support element comprises a first set of conducting elements, each of said conducting elements having a contact pad and a wiring pad,
wherein the second support element comprises a second set of conducting elements, each of said conducting elements having a contact pad and a wiring pad, and
wherein the first support element is connected to the at least one gripping area using at least a first snap-off junction area,
wherein the second support element is connected to the at least one gripping area using at least a second snap-off junction area, and
wherein each support element is configured to be overmoulded to obtain respectively a first and at least a second data carrier body.
2. The support strip according to claim 1 , wherein the support element is a support grid.
3. The support strip according to claim 1 , wherein the support element comprises a first set of foolproofing holes.
4. The support strip according to claim 3 , wherein the support element comprises a second set of foolproofing holes.
5. The support strip according to claim 2 , wherein the support grid is metallic.
6. The support strip according to claim 1 , wherein the first support element has a contour whose geometry substantially complies with GSM 11.11.
7. The support strip according to claim 1 , wherein the support element is arranged to receive an electronic component.
8. The support strip according to claim 7 , wherein the electronic component is a microcircuit.
9. The support strip of according to claim 1 , wherein the first support element is overmoulded using a thermoplastic.
10. The support strip according to claim 1 , wherein a microcircuit is connected to at least one wiring pad in the first set of conducting elements after the first support element has been overmoulded.