Imaging apparatus
View Patent ↗The imaging apparatus 1 comprises: a semiconductor imaging device 5 which converts incident light to an electrical signal; an optical filter 4 which is opposed to an incident surface of the semiconductor imaging device 5 and transmits light of a certain wavelength; and a three-dimensional substrate 2 fixing the optical filter 4 by means of adhesion using a filler-containing adhesive 6; wherein the diameter of the filler is smaller than or equal to the pixel size of the semiconductor imaging device 5 . Degradation of image quality of the imaging apparatus 1 caused by the dropped filler can thus be reduced.
1. An imaging apparatus comprising:
a semiconductor imaging device which converts incident light to an electrical signal;
an optical filter which is opposed to an incident surface of said semiconductor imaging device and transmits light of a certain wavelength; and
a fixing member fixing said optical filter by means of adhesion using a filler-containing adhesive;
wherein a diameter of said filler is smaller than or equal to a pixel size of said semiconductor imaging device.
2. The imaging apparatus according to claim 1 , wherein said fixing member is a three-dimensional substrate.
3. An imaging apparatus comprising:
a semiconductor imaging device which converts incident light to an electrical signal; and
a substrate fixing said semiconductor imaging device by means of adhesion using a filler-containing adhesive;
wherein a diameter of said filler is smaller than or equal to a pixel size of said semiconductor imaging device.
4. The imaging apparatus according to claim 1 or 3 , wherein said diameter of said filler is larger than or equal to 1/2 of a pixel size of said semiconductor imaging device.
5. The imaging apparatus according to claim 1 or 3 , wherein said filler is spherical in shape.
6. The imagining apparatus according to claim 1 or 3 , wherein said diameter of said filler is smaller than or equal to 3.8 μm.
7. A method of manufacturing an imaging apparatus comprising the steps of:
providing a substrate;
providing a semiconductor imaging device which converts incident light to an electrical signal, wherein the semiconductor imaging device has a pixel size;
mounting the semiconductor imaging device to the substrate;
providing an optical filter which transmits light of a certain wavelength;
selecting a filler-containing adhesive based on a diameter of the filler being smaller than or equal to the pixel size; and
mounting the optical filter to the substrate by means of adhesion using the filler-containing adhesive.
8. The method of claim 7 , wherein the diameter of the filler is larger than or equal to ½ of the pixel size.
9. The method of claim 7 , wherein the filler is spherical in shape.
10. The method of claim 7 , wherein the diameter of the filler is smaller than or equal to 3.8 μm.
11. A method of manufacturing an imaging apparatus comprising the steps of:
providing a substrate;
providing an optical filter which transmits light of a certain wavelength;
mounting the optical filter to the substrate;
providing a semiconductor imaging device which converts incident light to an electrical signal, wherein the semiconductor imaging device has a pixel size;
selecting a filler-containing adhesive based on a diameter of the filler being smaller than or equal to the pixel size; and
mounting the semiconductor imaging device to the substrate by means of adhesion using the filler-containing adhesive.
12. The method of claim 1 , wherein the diameter of the filler is larger than or equal to ½ of the pixel size.
13. The method of claim 11 , wherein the filler is spherical in shape.
14. The method of claim 11 , wherein the diameter of the filler is smaller than or equal to 3.8 μm.